Substrate

Abstract

The present invention relates to a substrate comprising a build-up and a solder resist layer disposed on the build-up. The solder resist layer has an upper surface facing away from the build-up. The solder resist layer has a plurality of grooves on its upper surface. The grooves of the solder resist layer can better eliminate or relieve the stress accumulated on large solder resist area induced by heat and/or material coefficient of thermal expansion mismatch of the substrate and thus can prevent and diminish warpage of the substrate or package.

What is claimed is: 
     
         1 . A substrate, comprising:
 a build-up layer; and   a solder resist layer disposed on the build-up and extending a width in a first direction and a length in a second direction different from the first direction, the solder resist layer comprising:
 an upper surface facing away from the build-up layer, and 
 a plurality of grooves disposed on the upper surface of the solder resist layer, 
   wherein the plurality of grooves comprise:
 a first groove set including a plurality of parallel first grooves; and 
 a second groove set including a plurality of parallel second grooves, wherein the plurality of parallel first grooves intersect with the plurality of parallel second grooves. 
   
     
     
         2 . The substrate of  claim 1 , wherein the plurality of parallel first grooves intersects at an intersecting angle with the plurality of parallel second grooves and the intersecting angle is in a range from 0° to 90°. 
     
     
         3 . The substrate of  claim 1 , wherein the plurality of parallel first grooves intersects at an intersecting angle of 90° with the plurality of parallel second grooves and the intersecting angle is 90°. 
     
     
         4 . A substrate, comprising:
 a build-up layer; and   a solder resist layer disposed on the build-up and extending a width in a first direction and a length in a second direction different from the first direction, the solder resist layer comprising:
 an upper surface facing away from the build-up layer, and 
 a plurality of grooves disposed on the upper surface of the solder resist layer, 
   wherein the grooves are defined by solder resist paths and a solder resist path disposed between two adjacent grooves is a discontinuous solder resist path.   
     
     
         5 . The substrate of  claim 4 , wherein the discontinuous solder resist path comprises a plurality of cylindrical solder resist bumps spaced from each other. 
     
     
         6 . The substrate of  claim 4 , wherein the discontinuous solder resist path comprises a plurality of prismatic solder resist bumps spaced from each other. 
     
     
         7 . The substrate of  claim 4 , wherein the discontinuous solder resist path comprises a plurality of cubic solder resist bumps spaced from each other. 
     
     
         8 . The substrate of  claim 4 , wherein the discontinuous solder resist path comprises a plurality of cylindrical, cubic and/or prismatic solder resist bumps spaced from each other.