US2018096962A1PendingUtilityA1

Substrate attachment for attaching a substrate thereto

62
Assignee: EV GROUP E THALLNER GMBHPriority: Dec 18, 2014Filed: Nov 22, 2017Published: Apr 5, 2018
Est. expiryDec 18, 2034(~8.3 yrs left)· nominal 20-yr term from priority
Inventors:Andreas Fehkuhrer
B32B 38/1841B32B 38/1858B32B 2457/14B32B 2309/105B32B 37/0046H10W 90/26H10W 72/0198H10W 72/07141H10W 72/071H10W 72/01953H10W 72/01951H10W 72/01971H10W 72/923H10W 72/019H10W 72/985H10W 46/301H10W 46/501H10W 90/00H10W 99/00H10W 80/301H10W 72/07236H10W 80/333H10W 80/334H10W 80/337H10W 80/335H10W 80/163H10W 80/102H10W 80/011H10W 80/037H10W 80/023H10W 80/016H10W 80/211H10W 72/0711H10W 72/07178H10W 90/792H10W 80/701H10W 46/00H10P 72/7434H10P 72/7432H10P 72/7416H10P 72/744H10P 54/00H10P 72/7402H10P 72/0428H10P 72/74H10P 72/72H10P 52/00H10P 10/128H10P 95/90H10P 95/00H10P 72/50H01L 2224/94H01L 2224/80006H01L 21/6836H01L 21/187H01L 24/80H01L 25/0657H01L 2224/75724H01L 2224/08121H01L 2224/80213H01L 2224/0381H01L 24/74H01L 2224/95H01L 21/78H01L 2221/68327H01L 21/6835H01L 2224/03831H01L 2223/54453H01L 2224/80907H01L 2224/97H01L 2224/80H01L 2224/0382H01L 2224/75251H01L 2224/75704H01L 2224/0224H01L 21/6831H01L 2224/80011H01L 2224/75735H01L 2924/00014H01L 2224/80003H01L 2224/80801H01L 2224/75702H01L 2224/75725H01L 2224/92H01L 2224/7598H01L 2224/75272H01L 2924/00012H01L 2224/80051H01L 24/94H01L 24/75H01L 24/08H01L 21/67092H01L 2224/80132H01L 2224/75744H01L 2224/80047H01L 2224/0384H01L 2224/8002H01L 2221/68363H01L 25/50H01L 2224/80099H01L 2224/8001H01L 2224/74H01L 2224/80093H01L 21/304H01L 2221/68381H01L 2224/80201H01L 2224/75701H01L 2224/75734H01L 2224/75745H01L 2224/80209H01L 2224/80203H01L 2223/54426H01L 2221/68368H01L 2224/08145H01L 24/97H01L 2224/75705H01L 2224/8013H01L 2225/06565H01L 2221/68304H01L 23/544H01L 2224/80894H01L 24/95H10W 72/011
62
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

Claims

exact text as granted — not AI-modified
1 . A substrate attachment for fixing a substrate thereto, comprising:
 a plate having a surface with attaching elements integrated therein, the plate being configured to elastically deform in response to a load applied to the surface of the plate, the attaching elements being configured to fix the substrate to the surface of the plate.   
     
     
         2 . The substrate attachment according to  claim 1 , wherein the plate is rigid in a state in which the plate is not supported. 
     
     
         3 . The substrate attachment according to  claim 1 , wherein the attaching elements comprise vacuum strips. 
     
     
         4 . The substrate attachment according to  claim 1 , wherein the plate comprises a vacuum valve disposed therein, the vacuum valve being configured to maintain a vacuum within the attaching elements to fix the substrate to the surface of the plate. 
     
     
         5 . The substrate attachment according to  claim 1 , further comprising:
 a control unit configured to control the attaching elements to fix the substrate to the surface of the plate.   
     
     
         6 . The substrate attachment according to  claim 5 , wherein the control unit comprises a valve configured to maintain a vacuum within the attaching elements to fix the substrate to the surface of the plate. 
     
     
         7 . The substrate attachment according to  claim 5 , wherein the control unit comprises a feed line for electric current to control the attaching elements to fix the substrate to the surface of the plate. 
     
     
         8 . The substrate attachment according to  claim 7 , wherein the attaching elements are electrostatic elements, and
 wherein the feed line for electric current is configured to control the electrostatic elements to fix the substrate to the surface of the plate.   
     
     
         9 . The substrate attachment according to  claim 7 , wherein the attaching elements are magnetic elements, and
 wherein the feed line for electric current is configured to control the magnetic elements to fix the substrate to the surface of the plate.

Join the waitlist — get patent alerts

Track US2018096962A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.