Fan-out panel level package and method of fabricating the same

Abstract

A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.

What is claimed is: 
     
         1 . A package comprising:
 a mold substrate;   a fan-out substrate disposed on the mold substrate, the fan-out substrate having a cavity;   a die disposed on the mold substrate in the cavity; and   interconnection lines disposed on the cavity between the fan-out substrate and the die, the interconnection lines connecting the die to the fan-out substrate, each of the interconnection lines includes,
 a first portion extending from the fan-out substrate to the die in a first direction, and 
 a second portion connected to the first portion, the second portion extending from the die to the fan-out substrate in a second direction different from the first direction. 
   
     
     
         2 . The package of  claim 1 , wherein the first portion and the second portion each have a first longitudinal axis and a second longitudinal axis intersecting each other on the die. 
     
     
         3 . The package of  claim 1 , wherein the fan-out substrate includes substrate electrodes connected to the first portions. 
     
     
         4 . The package of  claim 1 , wherein the die includes pad electrodes connected to the second portions. 
     
     
         5 . The package of  claim 1 , further comprising:
 an interlayer insulating layer disposed between the mold substrate and the interconnection lines, the interlayer insulating layer having contacts connecting the first and second portions of the interconnection lines to the fan-out substrate and the die, respectively.