Component mounting line control system

Abstract

A component mounting line control system controls a component mounting line. The component mounting line control system includes an acquirer, a first detector, a second detector, and a controller. The acquirer acquires set-up changing data. The first detector is provided on the upstream side of the reflow device and detects the board. The second detector is provided on the downstream side of the reflow device and detects the board. The controller changes a reflow condition based on the set-up changing data and the result of detection performed by the first detector and the second detector after the acquirer acquires the set-up changing data.

What is claimed is: 
     
         1 . A component mounting line control system which controls a component mounting line including a component mounting device that places a component on a board onto which solder is applied and a reflow device that heats the board so that the solder is molten and solidified, the system comprising:
 an acquirer that acquires set-up changing data;   a first detector that is provided on an upstream side of the reflow device and detects the board;   a second detector that is provided on a downstream side of the reflow device and detects the board; and   a controller that changes a reflow condition based on the set-up changing data and a result of detection performed by the first detector and the second detector, after the acquirer acquires the set-up changing data.   
     
     
         2 . The component mounting line control system of  claim 1 ,
 wherein the controller changes the reflow condition after it is detected that no board is present in the reflow device based on the result of detection performed by the first detector and the second detector.   
     
     
         3 . The component mounting line control system of  claim 1 ,
 wherein the controller changes the reflow condition in a case where the number of boards detected by the first detector and the number of boards detected by the second detector are the same as each other.   
     
     
         4 . The component mounting line control system of  claim 1 , further comprising:
 a storage that stores the number of boards,   wherein the controller changes the reflow condition in a case where the number of boards detected by the first detector and the second detector corresponds to the number of boards stored in the storage.   
     
     
         5 . The component mounting line control system of  claim 1 ,
 wherein the reflow condition includes a reflow temperature or a transported board width.   
     
     
         6 . A component mounting line control system which controls a component mounting line including a component mounting device that places a component on a board onto which solder is applied and a reflow device that heats the board so that the solder is molten and solidified, the system comprising:
 an acquirer that acquires set-up changing data;   a second detector that is provided on a downstream side of the reflow device and detects the board;   a controller that changes a reflow condition based on the set-up changing data and a result of detection performed by the second detector after the acquirer acquires the set-up changing data; and   a storage that stores the number of boards,   wherein the controller changes the reflow condition in a case where the number of boards detected by the second detector corresponds to the number of boards stored in the storage.