Heat dissipation module assembly and set-top box having the same

Abstract

Disclosed is a heat dissipation module assembly comprising: a base disposed adjacent to a heating unit and a heat dissipation module including one or more heat dissipation fins, the heat dissipation fin having an inlet portion and an outlet portion formed on both sides thereof and a hollow flow channel communicating with the inlet portion and the outlet portion, wherein the one or more heat dissipation fins being stacked to emit heat through the outlet portion, the heat being generated from the heating unit and absorbed by air flowed in through the inlet portion.

What is claimed is: 
     
         1 . A heat dissipation module assembly comprising:
 a base disposed adjacent to a heating unit; and   a heat dissipation module including one or more heat dissipation fins, the heat dissipation fin having an inlet portion and an outlet portion formed on both sides thereof and a hollow flow channel communicating with the inlet portion and the outlet portion, wherein the one or more heat dissipation fins being stacked to emit heat through the outlet portion, the heat being generated from the heating unit and absorbed by air flowed in through the inlet portion,   wherein a partition is disposed at the inlet portion to prevent the air heat-exchanged with the heating unit from flowing back to the inlet portion.   
     
     
         2 . The heat dissipation module assembly of  claim 1 , wherein the inlet portion is disposed adjacent to the base, the outlet portion is disposed with a difference in height upwards with respect to the inlet portion, and the disposition according to the difference in height between the inlet portion and the outlet portion induces air to rise and flow toward the outlet portion as air flowed in through the inlet portion is heat-exchanged with the heating unit. 
     
     
         3 . The heat dissipation module assembly of  claim 1 , wherein an inner wall of the one or more heat dissipation fins is sloped toward the outlet portion to reduce flow resistance of air flowing from the inlet portion through the outlet portion, the air being heat-exchanged with the heating unit. 
     
     
         4 . The heat dissipation module assembly of  claim 1 , wherein the heat dissipation module is formed by stacking the one or more heat dissipation fins in parallel to a plate surface of the base. 
     
     
         5 . The heat dissipation module assembly of  claim 1 , wherein at least one inlet portion is formed, and the outlet portion is formed corresponding to the number of the inlet portions. 
     
     
         6 . The heat dissipation module assembly of  claim 1 , wherein a pair of inlet portions formed in a different or opposite direction are disposed adjacent to the base, and a pair of outlet portions are disposed in a different or opposite direction with a difference in height upwards with respect to the pair of inlet portions. 
     
     
         7 . A heat dissipation module assembly comprising:
 a base disposed adjacent to a heating unit; and   a heat dissipation module including one or more heat dissipation fins, the heat dissipation fin having an inlet portion and an outlet portion formed on both sides thereof and a hollow flow channel communicating with the inlet portion and the outlet portion, wherein the one or more heat dissipation fins being stacked to emit heat through the outlet portion, the heat being generated from the heating unit and absorbed by air flowed in through the inlet portion,   wherein a cross-sectional area of the inlet portion through which air flows in is smaller than a cross-sectional area of the outlet portion through which air heat-exchanged with the heating unit is emitted.   
     
     
         8 . The heat dissipation module assembly of  claim 7 , wherein a pair of inlet portions formed in a different or opposite direction are disposed adjacent to the base, and a pair of outlet portions are disposed in a different or opposite direction with a difference in height upwards with respect to the pair of inlet portions. 
     
     
         9 . A heat dissipation module assembly comprising:
 a base disposed adjacent to a heating unit;   a heat dissipation module including one or more heat dissipation fins, the heat dissipation fin having an inlet portion and an outlet portion formed on both sides thereof and a hollow flow channel communicating with the inlet portion and the outlet portion, wherein the one or more heat dissipation fins being stacked to emit heat through the outlet portion, the heat being generated from the heating unit and absorbed by air flowed in through the inlet portion; and   a plate coupled to the heat dissipation module and disposed between the base and the heat dissipation module,   wherein a protrusion is disposed on at least one of the base and the plate, and a coupling portion to be coupled to the protrusion is disposed on the base or the plate.   
     
     
         10 . The heat dissipation module assembly of  claim 9 , wherein the protrusion and the coupling portion are formed in plurality in a circumference direction, and the heat dissipation module is coupled at a predetermined rotation angle with respect to the base such that the directions of the inlet portion and the outlet portion are adjusted. 
     
     
         11 . A set-top box comprising:
 a main body;   an electronic component disposed within the main body and configured to provide contents received from a content provider to a display device; and   a heat dissipation module assembly configured to dissipate heat, wherein the heat dissipation module assembly is disposed adjacent to the electronic component and has a heat dissipation module formed by stacking one or more heat dissipation fins having an inlet portion through which air flows in and an outlet portion through which air heat-exchanged with the electronic component is emitted, the inlet portion and the outlet portion being disposed on both sides of the heat dissipation module,   wherein a partition is disposed on the inlet portion to prevent air heat-exchanged with the electronic component from flowing back to the inlet portion.   
     
     
         12 . A set-top box comprising:
 a main body;   an electronic component disposed within the main body and configured to provide contents received from a content provider to a display device; and   a heat dissipation module assembly configured to dissipate heat, wherein the heat dissipation module assembly is disposed adjacent to the electronic component and has a heat dissipation module formed by stacking one or more heat dissipation fins having an inlet portion through which air flows in and an outlet portion through which air heat-exchanged with the electronic component is emitted, the inlet portion and the outlet portion being disposed on both sides of the heat dissipation module,   wherein a hollow flow channel is formed within the one or more heat dissipation fins, communicates with the inlet portion and the outlet portion, and guides air flowed in through the inlet portion toward the outlet portion, and a cross-sectional area of the inlet portion through which air flows in is smaller than a cross-sectional area of the outlet portion through which air heat-exchanged with the electronic component is emitted.   
     
     
         13 . The set-top box of  claim 11 , wherein the outlet portion is disposed with a difference in height upwards with respect to the inlet portion, and the disposition with the difference in height between the inlet portion and the outlet portion induces air being heat-exchanged with the electronic component to rise and flow toward the outlet portion. 
     
     
         14 . The set-top box of  claim 11 , wherein the dissipation fin includes an inner wall which is sloped toward the outlet portion to reduce flow resistance of air heat-exchanged with the electronic component flowing from the inlet portion to the outlet portion. 
     
     
         15 . The set-top box of  claim 11 , wherein the heat dissipation module assembly further comprises:
 a base disposed between the electronic component and the heat dissipation module to support the heat dissipation module,   wherein the heat dissipation module is formed by stacking the one or more heat dissipation fins in parallel to a plate surface of the base.   
     
     
         16 . The set-top box of  claim 15 , wherein the heat dissipation module assembly further comprises:
 a plate coupled to the heat dissipation module and disposed between the base and the heat dissipation module,   wherein a protrusion is disposed on at least one of the base, and a coupling portion to be coupled to the protrusion is disposed on the base or the plate.   
     
     
         17 . The set-top box of  claim 16 , wherein the protrusion and the coupling portion are formed in plurality in a circumference direction, and the heat dissipation module is coupled at a predetermined rotation angle with respect to the base such that directions of the inlet portion and the outlet portion are adjusted corresponding to an entrance/exit portion formed on the main body. 
     
     
         18 . The set-top box of  claim 11 , wherein a pair of inlet portions formed in a different or opposite direction are disposed adjacent to the base, and a pair of outlet portions are disposed in a different or opposite direction with a difference in height upwards with respect to the pair of inlet portions.