High sensitivity microphone and manufacturing method thereof
Abstract
A high sensitivity microphone includes a substrate having a through portion provided in a central portion thereof, a vibration membrane disposed on the substrate and covering the through portion, a fixed membrane installed above the vibration membrane, spaced apart from the vibration membrane with an air layer interposed therebetween, and having a plurality of air inlets perforated in a direction toward the air layer, and a plurality of support posts provided as vertical elastic posts between the fixed membrane and the vibration membrane and mechanically fixing the vibration membrane by a frictional force, regardless of an applied voltage.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A high sensitivity microphone comprising:
a substrate having a through portion formed in a central portion of the substrate; a vibration membrane disposed on the substrate and covering the through portion; a fixed membrane disposed above the vibration membrane, spaced apart from the vibration membrane with an air layer interposed therebetween, and having a plurality of air inlets perforated in a direction toward the air layer; and a plurality of support posts disposed between the fixed membrane and the vibration membrane, as elastic vertical posts, and mechanically fixing the vibration membrane by a frictional force regardless of an applied voltage.
2 . The high sensitivity microphone of claim 1 , wherein:
the support posts are formed of carbon nanotube (CNT) patterned between the fixed membrane and the vibration membrane and arranged at a predetermined interval in a circular shape from a central point of the fixed membrane.
3 . The high sensitivity microphone of claim 1 , wherein:
the support posts serve as springs with rigidity deformed by a sound pressure and are simultaneously deformed together with the vibration membrane by a sound pressure.
4 . The high sensitivity microphone of claim 1 , wherein:
the vibration membrane has a free-floating membrane structure whose contacts with respect to the support posts and the substrate are not attached.
5 . The high sensitivity microphone of claim 1 , wherein:
the vibration membrane has a depression and protrusion portion formed at edge on a bottom surface of the vibration membrane to prevent attachment of the vibration membrane to the substrate.
6 . The high sensitivity microphone of claim 1 , wherein:
the fixed membrane includes a support portion that vertically extends from an edge of the fixed membrane on the substrate.
7 . The high sensitivity microphone of claim 1 , wherein:
the fixed membrane has a fixed electrode disposed on a lower surface thereof and perforated in the same pattern as that of the air inlets.
8 . A method for manufacturing a high sensitivity microphone, the method comprising:
a) forming a first sacrificial layer on a substrate and forming a vibration membrane thereon; b) forming a second sacrificial layer on the vibration membrane and patterning carbon nanotube (CNT) seeds on opposing sides of the second sacrificial layer; c) forming a fixed membrane on the substrate including the CNT seeds and the second sacrificial layer; d) etching the fixed membrane to generate a plurality of perforated air inlets; and e) removing the first sacrificial layer and the second sacrificial layer and growing the CNT seeds to form a plurality of CNT support posts as vertical elastic posts between the fixed membrane and the vibration membrane to mechanically fix the vibration membrane by a frictional force, regardless of an applied voltage.
9 . The method of claim 8 , wherein operation a) comprises:
etching a portion of the first sacrificial layer to pattern a plurality of recesses; and forming a depression and protrusion portion by the plurality of recesses formed in the first sacrificial layer under the vibration membrane.
10 . The method of claim 8 , wherein operation b) comprises:
patterning a fixed electrode in a central portion of the second sacrificial layer.
11 . The method of claim 10 , wherein in operation d),
the fixed membrane and the fixed electrode are etched to generate a plurality of air inlets perforated in the same pattern.
12 . The high sensitivity microphone of claim 8 , wherein operation d) comprises:
etching a rear side of the substrate to form a through portion to which a sound pressure is input from the outside.
13 . The method of claim 8 , wherein
the vibration membrane includes a monolayer membrane formed of polysilicon or a silicon nitride or a multi-layer membrane formed by alternately stacking polysilicoin and a silicon nitride.
14 . The method of claim 8 , wherein
the first sacrificial layer and the second sacrificial layer are formed of any one of a photosensitive material, a silicon oxide, and a silicon nitride.
15 . The method of claim 8 , wherein operation e) comprises:
removing the first sacrificial layer to position the vibration membrane in a state of not being attached to the substrate; and fixing the vibration membrane positioned in a non-attached manner on the substrate by a frictional force of the CNT support posts.Join the waitlist — get patent alerts
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