Method And System For Hybrid Integration Of Optical Communication Systems

Abstract

Methods and systems for hybrid integration of optical communication systems are disclosed and may include receiving a continuous wave (CW) optical signal in a silicon photonics die (SPD) from an optical source external to the SPD. The received CW optical signal may be processed based on electrical signals received from an electronics die bonded to the SPD via metal interconnects. A modulated optical signal may be received in the SPD from optical fibers coupled to the SPD. An electrical signal may be generated in the SPD based on the received modulated optical signal and communicated to the electronics die via the metal interconnects. The CW optical signal may be received from an optical source assembly coupled to the SPD and/or from one or more optical fibers coupled to the SPD. The received CW optical signal may be processed utilizing one or more optical modulators, which may comprise Mach-Zehnder interferometer modulators.

What is claimed is: 
     
         1 . A method for communication, the method comprising:
 in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects:
 receiving a continuous wave (CW) non-modulated optical signal in said silicon photonics die from an optical source external to said silicon photonics die; 
 modulating said received CW non-modulated optical signal in said silicon photonics die using a first electrical signal received from said one or more electronics die via one or more of said metal interconnects; 
 receiving a modulated optical signal in said silicon photonics die; 
 generating a second electrical signal in said silicon photonics die based on said received modulated optical signal; and 
 communicating said second electrical signal to at least one of said one or more electronics die via one or more of said metal interconnects. 
   
     
     
         2 . The method according to  claim 1 , wherein said metal interconnects comprise copper pillars. 
     
     
         3 . The method according to  claim 1 , comprising receiving said CW non-modulated optical signal from an optical source assembly coupled to said silicon photonics die. 
     
     
         4 . The method according to  claim 1 , comprising receiving said CW non-modulated optical signal from an optical fiber coupled to said silicon photonics die. 
     
     
         5 . The method according to  claim 1 , comprising modulating said received CW non-modulated optical signal utilizing one or more optical modulators integrated in said silicon photonics die. 
     
     
         6 . The method according to  claim 5 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators. 
     
     
         7 . The method according to  claim 1 , comprising generating said second electrical signal utilizing one or more photodetectors integrated in said silicon photonics die. 
     
     
         8 . The method according to  claim 1 , comprising communicating optical signals into and/or out of said silicon photonics die utilizing grating couplers. 
     
     
         9 . The method according to  claim 1 , wherein said optical source comprises one or more semiconductor lasers. 
     
     
         10 . The method according to  claim 1 , wherein said optical communication system comprises a plurality of transceivers. 
     
     
         11 . A system for communication, the system comprising:
 an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects, said optical communication system being operable to:
 receive a continuous wave (CW) non-modulated optical signal in said silicon photonics die from an optical source external to said silicon photonics die; 
 modulate said received CW non-modulated optical signal in said silicon photonics die using a first electrical signal received from said one or more electronics die via one or more of said metal interconnects; 
 receive a modulated optical signal in said silicon photonics die; 
 generate a second electrical signal in said silicon photonics die based on said received modulated optical signal; and 
 communicate said second electrical signal to at least one of said one or more electronics die via one or more of said metal interconnects. 
   
     
     
         12 . The system according to  claim 11 , wherein said metal interconnects comprise copper pillars. 
     
     
         13 . The system according to  claim 11 , wherein said optical communication system is operable to receive said CW non-modulated optical signal from an optical source assembly coupled to said silicon photonics die. 
     
     
         14 . The system according to  claim 11 , wherein said optical communication system is operable to receive said CW non-modulated optical signal from an optical fiber coupled to said silicon photonics die. 
     
     
         15 . The system according to  claim 11 , wherein said optical communication system is operable to modulate said received CW non-modulated optical signal utilizing one or more optical modulators integrated in said silicon photonics die. 
     
     
         16 . The system according to  claim 15 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators. 
     
     
         17 . The system according to  claim 11 , wherein said optical communication system is operable to generate said second electrical signal utilizing one or more photodetectors integrated in said silicon photonics die. 
     
     
         18 . The system according to  claim 11 , wherein said optical communication system is operable to communicate optical signals into and/or out of said silicon photonics die utilizing grating couplers. 
     
     
         19 . The system according to  claim 11 , wherein said optical source comprises one or more semiconductor lasers. 
     
     
         20 . A system for communication, the system comprising:
 an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal pillars, said optical communication system being operable to:
 receive a continuous wave (CW) non-modulated optical signal in said silicon photonics die from an optical source external to said silicon photonics die; 
 modulate said received CW non-modulated optical signal based on a first electrical signal received from said one or more electronics die via one or more of said metal pillars; 
 receive a modulated optical signal in said silicon photonics die; 
 generate a second electrical signal utilizing a photodetector in said silicon photonics die based on said received modulated optical signal; and 
 communicate said second electrical signal to said one or more electronics die via one or more of said metal pillars.