Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method

Abstract

In a substrate cleaning device, with a polishing head in contact with one surface of a substrate rotated by a spin chuck, the polishing head is moved at least between a center and an outer periphery of the substrate. Thus, the one surface of the substrate is polished by the polishing head, and contaminants present on the one surface of the substrate are removed. At this time, capacity for removing contaminants by the polishing head is changed according to a position in a radial direction of the substrate. The capacity for removing contaminants refers to capacity for scraping contaminants adhering to the one surface of the substrate, and suction marks, contact marks and the like remaining on the one surface of the substrate by polishing. It is possible to change the capacity for removing contaminants by adjusting a pushing force exerted on the one surface of the substrate from the polishing head, for example.

I/We claim: 
     
         1 . A substrate cleaning device that removes contaminants from one surface of a substrate, comprising:
 a rotation holder that holds and rotates the substrate in a horizontal attitude;   a polisher configured to be capable of coming into contact with the one surface of the substrate;   a first mover that moves the polisher at least between a center and an outer periphery of the substrate while bringing the polisher into contact with the one surface of the substrate rotated by the rotation holder; and   a controller that controls at least one of the first mover and the rotation holder such that capacity for removing contaminants by the polisher is changed according to a position in a radial direction of the substrate rotated by the rotation holder.   
     
     
         2 . The substrate cleaning device according to  claim 1 , wherein
 the controller changes the capacity for removing contaminants by the polisher by changing a pushing force of the polisher by the first mover against the one surface of the substrate.   
     
     
         3 . The substrate cleaning device according to  claim 1 , wherein
 the controller changes the capacity for removing contaminants by the polisher by changing a moving speed of the polisher by the first mover between the center and the outer periphery of the substrate.   
     
     
         4 . The substrate cleaning device according to  claim 1 , wherein
 the first mover includes a rotation driver that rotates the polisher about an axis extending in an up-and-down direction, and   the controller changes the capacity for removing contaminants by the polisher by changing a rotation speed of the polisher by the rotation driver while bringing the polisher into contact with the one surface of the substrate.   
     
     
         5 . The substrate cleaning device according to  claim 1 , wherein
 the controller changes the capacity for removing contaminants by the polisher by changing a rotation speed of the substrate by the rotation holder.   
     
     
         6 . The substrate cleaning device according to  claim 1 , further comprising:
 a brush that can come into contact with the one surface of the substrate rotated by the rotation holder; and   a second mover that, after the polisher is moved while being in contact with the one surface of the substrate, brings the brush into contact with the one surface of the substrate held by the rotation holder.   
     
     
         7 . A substrate processing apparatus arranged to be adjacent to an exposure device, comprising:
 a coating device that applies a photosensitive film to an upper surface of a substrate;   the substrate cleaning device according to  claim 1 ; and   a transport device that transports the substrate among the coating device, the substrate cleaning device and the exposure device, wherein   the substrate cleaning device removes contaminants from a lower surface, used as one surface of the substrate, before exposure processing for the substrate by the exposure device.   
     
     
         8 . A substrate cleaning method for removing contaminants from one surface of a substrate, comprising the steps of:
 holding and rotating the substrate in a horizontal attitude;   moving a polisher at least between a center and an outer periphery of the substrate while bringing the polisher into contact with the one surface of the substrate rotated by the step of rotating the substrate; and   changing capacity for removing contaminants by the polisher according to a position in a radial direction of the substrate rotated by the step of rotating the substrate.   
     
     
         9 . A substrate processing method including the steps of:
 applying a photosensitive film to an upper surface of a substrate;   exposing the substrate to which the photosensitive film is applied; and   removing contaminants from a lower surface, used as the one surface of the substrate, by the substrate cleaning method according to  claim 8  before the step of exposing the substrate.