Interposer substrate and method of manufacturing the same

Abstract

A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming, on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.

1 .- 9 . (canceled) 
     
     
         10 . A method of manufacturing an interposer substrate, comprising:
 providing a carrier having a first wiring layer and a plurality of conductive pillars disposed on the first wiring layer;   forming on the carrier a first insulating layer that has a first surface and a second surface opposing the first surface and is coupled to the carrier via the first surface thereof, with the conductive pillars being exposed from the second surface of the first insulating layer;   forming on the second surface of the first insulating layer and the conductive pillars a second wiring layer that is electrically connected with the conductive pillars;   forming on the second surface of the first insulating layer and the second wiring layer a second insulating layer, from which a portion of a surface of the second wiring is exposed; and   removing the carrier to allow the first wiring layer to be exposed from the first surface of the first insulating layer.   
     
     
         11 . The method of  claim 10 , wherein the first insulating layer is formed on the carrier by a molding, coating, or lamination process. 
     
     
         12 . The method of  claim 10 , wherein the first wiring layer has a surface lower than the first surface of the first insulating layer. 
     
     
         13 . The method of  claim 10 , wherein each of the conductive pillars has a terminal surface flush with the second surface of the first insulating layer. 
     
     
         14 . The method of  claim 10 , wherein the second wiring layer is formed by a plurality of solder ball pads. 
     
     
         15 . The method of  claim 10 , wherein the surface of the second wiring layer is flush with a surface of the second insulating layer. 
     
     
         16 . The method of  claim 10 , wherein the surface of the second wiring layer is lower than a surface of the second insulating layer. 
     
     
         17 . The method of  claim 10 , wherein the second insulating layer is formed by a molding, coating or lamination process. 
     
     
         18 . The method of  claim 10 , wherein the entire carrier is removed. 
     
     
         19 . The method of  claim 10 , wherein a portion of the carrier is retained for acting as a supporting structure.