Method for producing relief-pattern forming, apparatus for producing the same, and seal
Abstract
A method and an apparatus for producing a relief-pattern forming, the method and apparatus being suitable for producing a film-like material, such as an embossed film, having a fine relief-structure pattern formed on a surface thereof so as to have a distinctive optical effect with higher quality, good productivity, and fewer defects. A transfer pattern printed layer having an inverted structure of a relief-structure pattern is formed on a second substrate by printing a transfer pattern onto the surface of a first substrate on which the relief-structure pattern is formed at a predetermined position by registration with the relief-structure pattern followed by drying, laminating with the second substrate, curing and peeling.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for producing a relief-pattern forming, comprising the steps of:
printing a transfer pattern onto a surface of a first substrate on which a relief-structure pattern is formed at a predetermined position using a printing ink containing an ionizing radiation-curable resin by registration with the relief-structure pattern; drying the printed transfer pattern; after the drying, laminating a second substrate onto the surface of the first substrate on which the transfer pattern has been printed; after the lamination, curing the printed transfer pattern by irradiating ionizing radiation; and after the curing, performing peeling at an interface between the transfer pattern and a surface of the first substrate on which the relief-structure pattern is formed to form the transfer pattern having an inverted structure of the relief-structure pattern on the second substrate.
2 . The method for producing a relief-pattern forming of claim 1 , wherein the lamination is thermal lamination.
3 . The method for producing a relief-pattern forming of claim 1 , wherein the peeling is performed while heating.
4 . The method for producing a relief-pattern forming of claim 1 , wherein the first substrate is composed of a plurality of layers, and a layer of the first substrate having the relief-structure pattern contains a fluorine-based release material.
5 . The method for producing a relief-pattern forming of claim 1 , wherein the second substrate is composed of a plurality of layers, and a layer of a surface to be laminated with the printed transfer pattern is an adhesive layer or a tacky layer.
6 . The method for producing a relief-pattern forming of claim 1 , wherein the irradiation of ionizing radiation is performed from the first substrate side.
7 . The method for producing a relief-pattern forming of claim 1 , wherein both the first substrate and the second substrate are subjected to the above-described processes while being conveyed between rolls.
8 . An apparatus for producing a relief-pattern forming, comprising:
a feeder that feeds a first substrate wound in a roll shape, and having a relief-structure pattern on one surface thereof; a printer section that prints a transfer pattern onto a surface of the first substrate on which the relief-structure pattern is formed using a printing ink containing an ionizing radiation-curable resin by registration with the relief-structure pattern to provide a transfer pattern printed layer; a dryer section that removes solvent components of the transfer pattern printed layer with hot air; a laminater section that pinches a surface of the first substrate on which the transfer pattern printed layer is formed and the second substrate, between two rolls, to bond them; a curing section that irradiates the transfer pattern printed layer with ionizing radiation in a state where the first substrate and the second substrate are bonded to each other; a separating section that peels off the second substrate from the first substrate while pinching them, between two rolls; and winding devices that take up the first substrate and the second substrate after being separated from each other, respectively.
9 . A seal formed by the production method of claim 1 , wherein the second substrate having the transfer pattern is stamping so as to include the transfer pattern.Join the waitlist — get patent alerts
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