US2018040543A1PendingUtilityA1

Lead frame and method for manufacturing same

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Assignee: MITSUI HIGH TECPriority: Jul 24, 2015Filed: Oct 17, 2017Published: Feb 8, 2018
Est. expiryJul 24, 2035(~9 yrs left)· nominal 20-yr term from priority
Inventors:Takahiro IshibashiKimihiko KuboRyota FurunoTakaaki Katsuda
H10W 90/726H10W 74/111H10W 70/424H10W 74/127H10W 70/458H10W 70/457H10W 70/40H01L 2224/16245H01L 23/3107H01L 23/3142H01L 23/49548H01L 23/49586H01L 23/49582
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Claims

Abstract

Provided is a lead frame including: one or more solder bonding regions containing copper material or copper plating; and a molding resin adhesion region containing a copper oxide film. The solder bonding regions are exposed on a surface of the lead frame. Further, provided is a lead frame manufacturing method including: forming a resist film in a molding resin adhesion region that is included in a surface of a lead frame member made of copper, or that is included in a surface of a copper-plated lead frame member; forming a plating film by performing a metal plating process on one or more solder bonding regions included in the surface of the lead frame member; removing the resist film; and forming a copper oxide film by oxidizing the molding resin adhesion region.

Claims

exact text as granted — not AI-modified
1 . A lead frame comprising:
 one or more solder bonding regions; and   a molding resin adhesion region containing a copper oxide film, wherein   the solder bonding regions are exposed on a surface of the lead frame.   
     
     
         2 . The lead frame according to  claim 1 , wherein the one or more solder bonding regions include a semiconductor chip bonding region. 
     
     
         3 - 10 . (canceled) 
     
     
         11 . The lead frame according to  claim 1 , wherein
 the solder bonding regions contains copper material or copper plating.   
     
     
         12 . The lead frame according to  claim 2 , wherein
 the solder bonding regions contains copper material or copper plating.   
     
     
         13 . The lead frame according to  claim 1 , wherein
 the solder bonding region contains a plating film of a metal capable of bonding with solder, and   the plating film has a thickness of 0.001 to 5 μm.   
     
     
         14 . The lead frame according to  claim 13 , wherein the metal is silver. 
     
     
         15 . The lead frame according to  claim 2 , wherein
 the solder bonding region contains a plating film of a metal capable of bonding with solder, and   the plating film has a thickness of 0.001 to 5 μm.   
     
     
         16 . The lead frame according to  claim 15 , wherein the metal is silver.

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