Single base multi-floating surface cooling solution

Abstract

An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

1 .- 15 . (canceled) 
     
     
         16 . A method comprising:
 placing a heat exchanger on a multi-chip package, the heat exchanger comprising the heat exchanger comprising at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and   coupling the heat exchanger to the multi-chip package.   
     
     
         17 . The method of  claim 16 , wherein the heat exchanger comprises a heat sink comprising an indivisible fin structure. 
     
     
         18 . The method of  claim 16 , wherein the heat exchanger comprises a heat sink comprising an indivisible heat sink base. 
     
     
         19 . The method of  claim 16 , wherein the heat sink base comprises a surface that defines a cavity, wherein a heat sink base portion is disposed in the cavity and defines the floating section. 
     
     
         20 . A multi-chip package assembly is made by the method of  claim 16 .