Coated copper particles and method for producing the same

Abstract

A method for producing coated copper particles having a surface coated with an aliphatic carboxylic acid, wherein the method comprises obtaining a reaction mixture containing copper formate, an amino alcohol, an aliphatic carboxylic acid having an aliphatic group having 5 or more carbon atoms, and a solvent, and subjecting a complex compound formed in the reaction mixture to thermal decomposition treatment to form metal copper, wherein a ΔSP value, which is a difference in SP value between the amino alcohol and the solvent, is 4.2 or more.

1 .- 6 . (canceled) 
     
     
         7 . A coated copper particle containing a copper particle coated with an aliphatic carboxylic acid having an aliphatic group having 5 or more carbon atoms, wherein the coated copper particle has an average primary particle diameter D SEM  of 0.02 to 0.2 mm, as determined by a SEM examination, wherein a value of a coefficient of variation of the particle size distribution (standard deviation SD/average primary particle diameter DSEM) is 0.1 to 0.5, and the coated copper particle has a DXRD/DSEM ratio of 0.25 to 1.00 wherein the DXRD/DSEM ratio is a ratio of a crystal particle diameter DXRD, as determined by a powder X-ray analysis, to an average primary particle diameter DSEM, as determined by a SEM examination. 
     
     
         8 . A coated copper particle having a surface coated with an aliphatic carboxylic acid having an aliphatic group having 5 or more carbon atoms, wherein the coated copper particle has a DXRD/DSEM ratio of 0.25 to 1.00 wherein the DXRD/DSEM ratio is a ratio of a crystal particle diameter DXRD, as determined by a powder X-ray analysis, to an average primary particle diameter DSEM, as determined by a SEM examination, and wherein the coated copper particle is a thermal decomposition product of a complex compound formed in a reaction mixture containing copper formate, an amino alcohol, an aliphatic carboxylic acid having an aliphatic group having 5 or more carbon atoms, and a solvent, wherein a DSP value, which is a difference in SP value between the amino alcohol and the solvent, is 4.2 or more. 
     
     
         9 .- 11 . (canceled) 
     
     
         12 . The coated copper particle according to  claim 7  which is a thermal decomposition product of a complex compound formed in a reaction mixture containing copper formate, an amino alcohol, an aliphatic carboxylic acid having an aliphatic group having 5 or more carbon atoms, and a solvent, wherein a DSP value, which is a difference in SP value between the amino alcohol and the solvent, is 4.2 or more. 
     
     
         13 . The coated copper particles according to  claim 7 , wherein the aliphatic carboxylic acid physically adsorbs on the surface of the copper particles. 
     
     
         14 . The coated copper particles according to  claim 8 , wherein the aliphatic carboxylic acid physically adsorbs on the surface of the copper particles. 
     
     
         15 . The coated copper particles according to  claim 12 , wherein the aliphatic carboxylic acid physically adsorbs on the surface of the copper particles. 
     
     
         16 . A conductive composition comprising coated copper particles according to  claim 7  and a medium. 
     
     
         17 . A conductive composition comprising coated copper particles according to  claim 8  and a medium. 
     
     
         18 . A conductive composition comprising coated copper particles according to  claim 12  and a medium. 
     
     
         19 . A conductive composition comprising coated copper particles according to  claim 13  and a medium. 
     
     
         20 . A conductive composition comprising coated copper particles according to  claim 14  and a medium. 
     
     
         21 . A conductive composition comprising coated copper particles according to  claim 15  and a medium. 
     
     
         22 . A circuit formed article comprising a substrate, and a wiring pattern which is disposed on the substrate, and which is a thermal treatment product of the conductive composition according to  claim 16 . 
     
     
         23 . A circuit formed article comprising a substrate, and a wiring pattern which is disposed on the substrate, and which is a thermal treatment product of the conductive composition according to  claim 17 . 
     
     
         24 . A circuit formed article comprising a substrate, and a wiring pattern which is disposed on the substrate, and which is a thermal treatment product of the conductive composition according to  claim 18 . 
     
     
         25 . A circuit formed article comprising a substrate, and a wiring pattern which is disposed on the substrate, and which is a thermal treatment product of the conductive composition according to  claim 19 . 
     
     
         26 . A composition comprising the coated copper particles according to  claim 7 , amino alcohol, and a solvent, wherein a DSP value, which is a difference in SP value between the amino alcohol and the solvent, is 4.2 or more. 
     
     
         27 . A composition comprising the coated copper particles according to  claim 8 , amino alcohol, and a solvent, wherein a DSP value, which is a difference in SP value between the amino alcohol and the solvent, is 4.2 or more. 
     
     
         28 . A composition comprising the coated copper particles according to  claim 12 , amino alcohol, and a solvent, wherein a DSP value, which is a difference in SP value between the amino alcohol and the solvent, is 4.2 or more. 
     
     
         29 . A composition comprising the coated copper particles according to  claim 13 , amino alcohol, and a solvent, wherein a DSP value, which is a difference in SP value between the amino alcohol and the solvent, is 4.2 or more.