Image pickup unit and method of manufacturing the same

Abstract

An image pickup device and a method of the same are described herein. By way of first example, the image pickup device includes a seal member having a first surface, the first surface of the seal member including a concave portion, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member. By way of a second example, the image pickup device includes a seal member having a first surface, the first surface being a polished surface, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member.

What is claimed is: 
     
         1 . An image pickup device, comprising:
 an optically-transparent seal member that comprises a first surface and a second surface, wherein the second surface is opposite to the first surface, and wherein the optically-transparent seal member includes an outer region and an inner region;   an optical device coupled to the second surface, wherein the optical device includes an optical sensor with a light receiving surface; and   a resin layer configured to fill a gap between the light receiving surface and the second surface.   
     
     
         2 . The image pickup device according to  claim 1 , wherein the outer region protrudes beyond the inner region by a distance (D) in a direction perpendicular to the second surface. 
     
     
         3 . The image pickup device according to  claim 1 , wherein the optical sensor includes an optical element region on a third surface of a substrate, wherein the first surface of the substrate faces toward the optically-transparent seal member, and wherein the optical element region is configured for photoelectric conversion. 
     
     
         4 . The image pickup device according to  claim 3 , wherein the second surface is adhered to the optical device by the resin layer. 
     
     
         5 . The image pickup device according to  claim 4 , wherein
 the optical device further includes a connection pad on the third surface of the substrate, and   the connection pad is connected to an external connection terminal on a fourth surface of the substrate through a via-electrode, wherein the fourth surface of the substrate is opposite from the third surface of the substrate.   
     
     
         6 . The image pickup device according to  claim 5 , wherein
 an insulating layer is on the third surface of the substrate, and a portion of the insulating layer is between the connection pad and the resin layer.   
     
     
         7 . The image pickup device according to  claim 5 , wherein the connection pad is in direct contact with the resin layer. 
     
     
         8 . The image pickup device according to  claim 2 , wherein the outer region protrudes beyond the inner region at a step that has a lateral wall, and wherein the lateral wall is substantially parallel to the direction perpendicular to the first surface. 
     
     
         9 . The image pickup device according to  claim 3 , wherein the first surface comprises a concave portion that includes the outer region and the inner region on the first surface, wherein the outer region protrudes beyond the inner region by a distance (D) in a direction perpendicular to the first surface, and
 wherein the inner region aligns with the optical element region in the direction perpendicular to the first surface.   
     
     
         10 . The image pickup device according to  claim 1 , wherein the first surface is larger than the second surface. 
     
     
         11 . The image pickup device according to  claim 1 , wherein the optically-transparent seal member has a thickness in range of 450 μm to 800 μm and a refractive index of about 1.5. 
     
     
         12 . The image pickup device according to  claim 1 , wherein the resin layer has a thickness in range of 10 μm to 100 μm. 
     
     
         13 . The image pickup device according to  claim 1 , wherein the first region comprises the outer region as a light waveguide, and wherein the light waveguide is configured to guide light for a distance, towards a region with a connection pad. 
     
     
         14 . An image pickup device, comprising:
 an optically-transparent seal member that comprises a first surface, wherein the first surface is a polished surface and includes a concave portion,   wherein the concave portion includes an outer region as a light waveguide, and an inner region;   an optical device coupled to a second surface of the optically-transparent seal member, wherein the second surface is opposite to the first surface, wherein the optical device includes an optical sensor with a light receiving surface; and   a resin layer configured to fill a gap between the light receiving surface and the second surface.