Forming device

Abstract

A forming device that expands a metal pipe material to form a metal pipe includes: an upper die and a lower die that form a main cavity part forming a main body part of the metal pipe and a sub-cavity part forming a flange part of the metal pipe by surfaces thereof opposed to each other; and a shielding member that prevents foreign matter discharged from the main cavity part or the sub-cavity part from scattering, the sub-cavity part is extended to be opened to the outside of the die in a direction crossing an extending direction of the metal pipe material, and the shielding member is provided on a line in which the sub-cavity part extends in the expanding of the metal pipe material.

What is claimed is: 
     
         1 . A forming device that expands a metal pipe material to form a metal pipe, the device comprising:
 an upper die and a lower die that form a main cavity part forming a main body part of the metal pipe and a sub-cavity part forming a flange part of the metal pipe by surfaces thereof opposed to each other; and   a shielding member that prevents foreign matter discharged from the main cavity part or the sub-cavity part from scattering,   wherein the sub-cavity part is extended to be opened to the outside of the die in a direction crossing an extending direction of the metal pipe material, and   the shielding member is provided on a line in which the sub-cavity part extends in the expanding of the metal pipe material.   
     
     
         2 . The forming device according to  claim 1 ,
 wherein the shielding member blocks the sub-cavity part from a direction in which the sub-cavity part is extended.   
     
     
         3 . The forming device according to  claim 2 ,
 wherein the shielding member is provided to be brought into contact with a side surface of the upper die or the lower die and is moved with the movement of the upper die or the lower die to block the sub-cavity part from the direction in which the sub-cavity part is extended in a case where the die is closed.