Optoelectronic module and a process for the production of an optoelectronic module

Abstract

An optoelectronic module ( 100 ) is defined, comprising at least one semiconductor chip ( 10 ) provided for emitting electromagnetic radiation and at least one holding device ( 20 ) which is adapted to fix in place a device ( 50 ) for encoding at least one optical or electronic parameter of the optoelectronic module ( 100 ). Furthermore, a process for the production of the optoelectronic module ( 100 ) is defined.

What is claimed is: 
     
         1 . A process for the production of an optoelectronic module having the steps of:
 a) providing an optoelectronic module having at least one semiconductor chip provided for emitting electromagnetic radiation;   b) measuring an optical or electronic parameter of the optoelectronic module;   c) providing an encoding element, especially in the form of a surface-mountable device, wherein the encoding element carries information relating to the optical or electronic parameter of the optoelectronic module; and   d) fixing the encoding element in place in or on the optoelectronic module.   
     
     
         2 . The process according to  claim 1 ,
 wherein in step a) an optoelectronic module is provided and in step d) the encoding element is inserted or pushed into the fixing position along the insertion direction,   wherein the optoelectronic module comprises:
 at least one semiconductor chip provided for emitting electromagnetic radiation; and 
 at least one holding device which is adapted to fix in place the encoding element, 
 wherein the holding device comprises at least one locking device which is movable between a locking position and a receiving position, 
 wherein in the receiving position the encoding element can be displaced along an insertion direction towards a fixing position inside the holding device, and 
 wherein in the locking position the locking device is adapted to effect at least partial fixing of the encoding element in the fixing position. 
   
     
     
         3 . The process according to  claim 1 ,
 wherein at least one of the steps a) to d) is carried out at least partly in a pick-and-place machine.   
     
     
         4 . The process according to  claim 1 ,
 wherein the encoding element is a surface-mountable device and the encoding element is fixed in place in or on the optoelectronic module using surface-mounting technology.   
     
     
         5 . The process according to  claim 1 ,
 wherein one holding device is provided which is adapted to fix in place the encoding element, wherein the optoelectronic module comprises a carrier element and the holding device is arranged on or in the carrier element or on or in a plug-in element or plug-in connector attached to the carrier element.   
     
     
         6 . The process according to  claim 5 ,
 wherein the holding device is formed at least in part by a recess in the carrier element, in the plug-in element or in the plug-in connector and wherein the encoding element is arranged in the recess.   
     
     
         7 . The process according to  claim 1 ,
 wherein the optoelectronic module comprises a holding device having a recess which is adapted to fix in place the encoding element, and   wherein after fixing the encoding element a heated stamp is pushed onto a surface of the optoelectronic module in a region including the recess, so that material is plastically deformed in a deformation region and the holding device fully encompasses the encoding element.   
     
     
         8 . The process according to  claim 1 ,
 wherein a holding device is provided which is adapted to fix in place the encoding element, and   wherein the holding device is adapted to effect an irreversible fixing of the encoding element.   
     
     
         9 . The process according to  claim 1 ,
 wherein the optoelectronic module comprises a holding device having a recess which is adapted to fix in place the encoding element, and   wherein a cover element of the holding device is arranged over the recess, so that the encoding element is fixed by a form locking manner on the one hand by lateral inner faces of the recess and on the other hand by the cover element and by a base face of the recess, and in this way the holding device fully encompasses the encoding element.   
     
     
         10 . The process according to  claim 1 ,
 wherein a holding device is provided which is adapted to fix in place the encoding element, said the holding device comprising at least one locking device which is movable between a locking position and a receiving position,   wherein in the receiving position the encoding element can be displaced along an insertion direction towards a fixing position inside the holding device and wherein in the locking position the locking device is adapted to effect at least partial fixing of the encoding element in the fixing position.   
     
     
         11 . The process according to  claim 10 ,
 wherein the locking device comprises at least one locking element made of an elastic material which is adapted to allow a displacement of the encoding element along the insertion direction towards the fixing position as a result of its being elastically deformed in consequence of the displacement, and further, once the fixing position of the encoding element has been reached, to assume its original shape and hereby fix the encoding element in place.   
     
     
         12 . The process according to  claim 11 ,
 wherein the locking element is in the form of a tongue which, in the locking position, forms an acute angle of less than 30° with the insertion direction and projects from a lateral inner wall of the holding device.   
     
     
         13 . The process according to  claim 10 ,
 wherein in step d) the encoding element is inserted or pushed into the fixing position along the insertion direction.   
     
     
         14 . The process according to  claim 1 ,
 wherein the encoding element carries information relating to an initial brightness of the optoelectronic module and a resistance value of the encoding element is chosen so that direct or indirect measurement of the resistance value enables conclusions to be drawn as to the initial brightness of the optoelectronic module.   
     
     
         15 . A process for the production of an optoelectronic module having the steps of:
 a) providing an optoelectronic module having at least one semiconductor chip provided for emitting electromagnetic radiation;   b) measuring an optical or electronic parameter of the optoelectronic module;   c) providing an encoding element in the form of a surface-mountable device having two electrical contact surfaces wherein the encoding element carries information relating to the optical or electronic parameter of the optoelectronic module; and   d) fixing the encoding element in place in or on the optoelectronic module, wherein the optoelectronic module has a holding device which comprises a recess and electrical contact elements being arranged on a base face of the recess, wherein in a fixing position, the two electrical contact surfaces of the encoding element lie on the electrical contact elements in the recess.   
     
     
         16 . A process for acquiring information provided by the encoding element of the optoelectronic module produced according to  claim 15 ,
 wherein a control unit for driving the optoelectronic module is provided, and   wherein information provided by the encoding element is acquired by the control unit via electrical conductor tracks, said electrical conductor tracks being connected to the two electrical contact surfaces of the encoding element via the electrical contact elements of the holding device.   
     
     
         17 . The process according to  claim 16 ,
 wherein the encoding element carries information relating to an initial brightness of the optoelectronic module and a resistance value of the encoding element is chosen so that direct or indirect measurement of the resistance value enables conclusions to be drawn as to the initial brightness of the optoelectronic module.