US2017372928A1PendingUtilityA1

Substrate processing system and temperature control method

Assignee: TOKYO ELECTRON LTDPriority: Jun 24, 2016Filed: Jun 22, 2017Published: Dec 28, 2017
Est. expiryJun 24, 2036(~9.9 yrs left)· nominal 20-yr term from priority
H10P 72/0434H10P 72/0432H10P 72/72H10P 72/0602C23C 16/5096H05B 1/0233C23C 16/52C23C 16/50H01J 37/32009H01J 37/32724H01J 2237/334C23C 16/463C23C 16/46H10P 72/722H10P 72/0431H10P 72/0421H10P 72/04H01L 21/67248H01L 21/6831H01L 21/67103H10P 74/203
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Claims

Abstract

Disclosed is a substrate processing system including a substrate processing apparatus; and a control device that controls the substrate processing apparatus. The substrate processing apparatus includes: a chamber; a placing table provided within the chamber; and heaters embedded in the placing table corresponding to division regions, respectively. The control device includes: a holding unit that holds a table for each of the division regions; a measuring unit that measures the resistance value of each of the heaters embedded in the placing table for each of the division regions; and a controller that estimates a temperature of each of the division regions corresponding to the resistance value of each of the heaters measured by the measuring unit with reference to the table for each of the division regions, and controls an electric power to be supplied to each of the heaters so that the estimated temperature becomes a target temperature.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A substrate processing system comprising:
 a substrate processing apparatus; and   a control device that controls the substrate processing apparatus,   the substrate processing apparatus comprising:
 a chamber; 
 a placing table provided within the chamber, on which a processing target substrate is placed; and 
 heaters embedded in the placing table corresponding to division regions, respectively, that is, a plurality of divided regions of the top surface of the placing table, 
   the control device comprising:
 a holding unit that holds a table for each of the division regions, the table indicating a relationship between a resistance value of each of the heaters embedded in the placing table and a temperature of each of the division regions; 
 a measuring unit that measures the resistance value of each of the heaters embedded in the placing table for each of the division regions; and 
 a controller that estimates a temperature of each of the division regions corresponding to the resistance value of each of the heaters measured by the measuring unit with reference to the table for each of the division regions, and controls an electric power to be supplied to each of the heaters so that the estimated temperature becomes a target temperature. 
   
     
     
         2 . The substrate processing system of  claim 1 , wherein an AC voltage and an AC current are supplied to each of the heaters, and
 the measuring unit measures the resistance value of each of the heaters based on instantaneous values of the AC voltage and the AC current at an intermediate timing between adjacent zero-cross points at which the instantaneous value of the AC voltage supplied to each of the heaters becomes 0 V.   
     
     
         3 . The substrate processing system of  claim 1 , wherein a temperature sensor is provided in the placing table corresponding to at least one of the division regions, and
 when a difference equal to or larger than a predetermined value occurs between a temperature of the division region measured by the temperature sensor and a temperature estimated based on a resistance value of the heater provided in the division region, the controller corrects temperatures estimated for all division regions based on the difference.   
     
     
         4 . A temperature control method that controls the temperature of a surface of a placing table on a substrate processing apparatus including: a chamber, a placing table provided within the chamber, on which a processing target substrate is placed, and heaters embedded in the placing table corresponding to division regions, respectively, that is, a plurality of divided regions of the top surface of the placing table,
 the method being performed by a control device and, comprising:   measuring the resistance value of each of the heaters embedded in the placing table for each of the division regions;   estimating a temperature of each of the division regions corresponding to the resistance value of each of the heaters measured with reference to the table for each of the division regions, the table indicating a relationship between a resistance value of each of the heaters embedded in the placing table and a temperature of each of the division regions; and   controlling an electric power to be supplied to each of the heaters so that the estimated temperature becomes a target temperature.   
     
     
         5 . The temperature control method of  claim 4 , wherein an AC voltage and an AC current are supplied to each of the heaters, and
 in the measuring of the resistance value, the resistance value of each of the heaters is measured based on instantaneous values of the AC voltage and the AC current at an intermediate timing between adjacent zero-cross points at which the instantaneous value of the AC voltage supplied to each of the heaters becomes 0 V.   
     
     
         6 . The temperature control method of  claim 4 , wherein a temperature sensor is provided in the placing table corresponding to at least one of the division regions, and
 in the controlling of the electric power, when a difference equal to or larger than a predetermined value occurs between a temperature of the division region measured by the temperature sensor and a temperature estimated based on a resistance value of the heater provided in the division region, temperatures estimated for all division regions are corrected based on the difference.   
     
     
         7 . The temperature control method of  claim 6  further comprising:
 executing creating the table, 
 wherein the creating of the table further including: 
 controlling an electric power to be supplied to the heater provided in the division region for each setting temperature based on a temperature measured by the temperature sensor so that the temperature of the division region provided with the temperature sensor becomes the setting temperature; 
 measuring a radiation amount of light with a predetermined wavelength emitted from each of the division regions, for each setting temperature, using a camera; 
 controlling an electric power to be supplied to each of the heaters provided in each of the division regions so that a difference between the radiation amount of light with a predetermined wavelength emitted from other division regions not provided with the temperature sensor, and the radiation amount of light with a predetermined wavelength emitted from the division region provided with the temperature sensor falls within a predetermined value, for each setting temperature; 
 measuring a resistance value of each of the heaters provided in each of the division regions, for each setting temperature; and 
 creating a table in which the setting temperature is associated with the resistance value of each of the heaters provided in each of the division regions.

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