Electronic component having multilayer structure and method of manufacturing the same

Abstract

An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

What is claimed is: 
     
         1 . An electronic component comprising:
 a laminate formed by stacking a plurality of ceramic bodies; and   an external electrode made of a conductive resin for connecting each ceramic body.   
     
     
         2 . The electronic component according to  claim 1 , further comprises:
 an adhesive for adhering between the ceramic bodies.   
     
     
         3 . The electronic component according to  claim 1 , wherein the ceramic bodies are multi-layered ceramic capacitors (MLCC). 
     
     
         4 . The electronic component according to  claim 3 , wherein each of the multi-layered ceramic capacitors has an inner electrode structure different from each other. 
     
     
         5 . The electronic component according to  claim 3 , wherein each of the multi-layered ceramic capacitors has an electrostatic capacity different from each other. 
     
     
         6 . The electronic component according to  claim 1 , further comprising a metal layer plated on the external electrode. 
     
     
         7 . An electronic component comprising:
 a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and   an external electrode made of a conductive resin for connecting each ceramic body,   wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitors, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor.   
     
     
         8 . The electronic component according to  claim 7 , wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is one of an open structure multi-layered ceramic capacitor, a T-HMC structure multi-layered ceramic capacitors, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor. 
     
     
         9 . The electronic component according to  claim 8 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor. 
     
     
         10 . The electronic component according to  claim 9 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two. 
     
     
         11 . The electronic component according to  claim 7 , further comprises:
 an adhesive for adhering between the multi-layered ceramic capacitors.   
     
     
         12 . The electronic component according to  claim 7 , further comprises:
 a metal layer plated on a surface of the external electrode.   
     
     
         13 . A method of manufacturing an electronic component comprising:
 preparing a plurality of different multi-layered ceramic capacitors;   stacking the plurality of multi-layered ceramic capacitors; and   forming external terminals made of a conductive resin on opposite ends of a laminate obtained by stacking the plurality of multi-layered ceramic capacitors.   
     
     
         14 . The method of manufacturing the electronic component according to  claim 13 , wherein, in the stacking the plurality of multi-layered ceramic capacitors, any one of the multi-layered ceramic capacitors selected from an open structure, a T-HMC structure, a float structure, a T-HMC-open structure, a T-HMC-float structure is arranged at a lowermost surface. 
     
     
         15 . The method of manufacturing the electronic component according to  claim 14 , wherein the normal structure multi-layered ceramic capacitor is stacked on a top of the lowermost multi-layered ceramic capacitor. 
     
     
         16 . The method of manufacturing the electronic component according to  claim 13 , wherein, in the stacking the plurality of multi-layered ceramic capacitors, after any one of the multi-layered ceramic capacitors selected from an open structure, a T-HMC structure, a float structure, a T-HMC-open structure, a T-HMC-float structure is arranged at a lowermost surface, a multi-layered ceramic capacitor having a structure different from the lowermost multi-layered ceramic capacitor among the T-HMC structure, the float structure, the T-HMC-open structure and the T-HMC-float structure is stacked and a normal structure multi-layered ceramic capacitor is stacked on an uppermost surface. 
     
     
         17 . The method of manufacturing the electronic component according to  claim 13 , wherein, when the plurality of multi-layered ceramic capacitors are stacked, after an adhesive resin is coated between the multi-layered ceramic capacitors, it is cured. 
     
     
         18 . The method of manufacturing the electronic component according to  claim 13 , wherein forming the external terminals is performed by sintering after coating a conductive paste on opposite ends of the laminate. 
     
     
         19 . An electronic component comprising:
 a laminate including a plurality of ceramic bodies stacking one on another and one or more adhesive layers interposed therebetween, each ceramic body including a plurality of first internal electrodes exposed to one end of the laminate and a plurality of second internal electrodes exposed to another end of the laminate, and the first and second internal electrodes of ceramic bodies including a first boundary internal electrode and a second boundary internal electrode, wherein all the other first and second internal electrodes of the ceramic bodies are interposed between the first and second boundary internal electrodes;   a first external electrode formed of a conductive resin on the one end of the laminate and electrically connected to the plurality of first internal electrodes of the plurality of ceramic bodies; and   a second external electrode formed of the conductive resin on the other end of the laminate and electrically connected to the plurality of second internal electrodes of the plurality of ceramic bodies.   
     
     
         20 . The electronic component of  claim 19 , wherein a dielectric material interposed between the internal electrodes of the same ceramic body is different from a material forming the one or more adhesive layers. 
     
     
         21 . The electronic component of  claim 20 , wherein the dielectric material is piezoelectric or electrostrictive. 
     
     
         22 . The electronic component of  claim 19 , further comprising a metal layer plated on each external electrode. 
     
     
         23 . The electronic component of  claim 19 , wherein a width of each internal electrode of the ceramic body which the first boundary internal electrode belongs to, determined in a direction from the first external electrode to the second external electrode, is less than that of any other internal electrodes. 
     
     
         24 . The electronic component of  claim 19 , wherein:
 in a vertical direction along which the ceramic bodies stack, each internal electrode of the ceramic body which the first boundary internal electrode belongs to, overlaps with extension portions of only one of the first and second external electrodes, and   in the vertical direction, each internal electrode of the ceramic body or the ceramic bodies which the first boundary internal electrode does not belong to, overlaps with the extension portions of both of the first and second external electrodes.   
     
     
         25 . The electronic component of  claim 19 , wherein:
 the ceramic body, which the first boundary internal electrode belongs to, includes a plurality of floating internal electrodes not electrically connected to any of the first and second external electrodes, and   in the ceramic body, which the first boundary internal electrode belongs to, one of the first internal electrodes and one of the second internal electrodes are formed on a same plane.   
     
     
         26 . The electronic component of  claim 25 , wherein in a vertical direction along which the ceramic bodies stack, each internal electrode of the ceramic body or the ceramic bodies, which the first boundary internal electrode does not belong to, overlaps with extension portions of both of the first and second external electrodes. 
     
     
         27 . The electronic component of  claim 19 , wherein a capacitance of the ceramic body which the first boundary internal electrode belongs to, is less than a capacitance of each remaining ceramic body.