US2017355058A1PendingUtilityA1

Multiphase Cutting

Assignee: ISAJANYAN ARSHAKPriority: Jun 9, 2016Filed: Jun 9, 2016Published: Dec 14, 2017
Est. expiryJun 9, 2036(~9.8 yrs left)· nominal 20-yr term from priority
B24B 41/005B24B 9/163B24B 47/20
15
PatentIndex Score
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Claims

Abstract

Multiphase Cutting may comprise a bulk removal pass followed by a fine removal pass to cut a gemstone. For example, multiphase cutting may perform a removal by removing approximately 90% of material during a first pass and then reset and remove the remaining 10% of material during a second pass. The second pass may use a slower feed rate and a wider oscillation, moving the gemstone across an entire range of a lap wheel. This split setup may thus produce significantly more accurate results for the accuracy of the total removal.

Claims

exact text as granted — not AI-modified
1 . A method of cutting a gemstone, comprising:
 removing a majority of material from a stone using a first feed rate and a first oscillation setting; and   removing a remaining material from the stone using a second feed rate and a second oscillation setting, the second feed rate being lower than the first feed rate, and the second oscillation setting giving a larger oscillation than the first oscillation setting.   
     
     
         2 . The method of  claim 1 , wherein the cutting is performed by a robot. 
     
     
         3 . The method of  claim 1 , wherein the second feed rate is between one-tenth and one-fifth of the first feed rate.

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