Composition for organic electronic device encapsulant and encapsulant formed using the same

Abstract

The present application relates to a composition for an encapsulant and an encapsulant formed using the same. The composition for an encapsulant according to one embodiment of the present application includes 1) a silicone resin; 2) one or more types of moisture absorbents; and 3) one or more types of photoinitiators.

1 . A composition for an encapsulant comprising:
 1) a silicone resin;   2) one or more types of moisture absorbents; and   3) one or more types of photoinitiators.   
     
     
         2 . The composition for an encapsulant of  claim 1 , wherein the silicone resin is an organopolysilicone-based resin. 
     
     
         3 . The composition for an encapsulant of  claim 2 , wherein the organopolysilicone-based resin is one or more types selected from among compounds represented by the following Chemical Formula 1: 
       
         
           
           
               
               
           
         
         wherein, in Chemical Formula 1, 
         R 1  to R 6  are the same as or different from each other, and each independently selected from the group consisting of hydrogen, an alkyl group, an alkenyl group, an aryl group, a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, a vinyl group, an acrylate group, a methacrylate group, an epoxide group, a cyclic ether group, a sulfide group, an acetal group, a lactone group and an amide group; and 
         a, b, c and d are each independently a real number of 0 to 1, and (a+b+c+d) is 1. 
       
     
     
         4 . The composition for an encapsulant of  claim 1 , wherein a content of the silicone resin is from 1% by weight to 80% by weight based on a total weight of the composition for an encapsulant. 
     
     
         5 . The composition for an encapsulant of  claim 1 , wherein the moisture absorbent includes one or more types selected from the group consisting of metal powders, metal oxides, organic metal oxides, metal salts or phosphorous pentoxide (P 2 O 5 ). 
     
     
         6 . The composition for an encapsulant of  claim 1 , wherein a content of the moisture absorbent is from 10% by weight to 90% by weight based on a total weight of the composition for an encapsulant. 
     
     
         7 . The composition for an encapsulant of  claim 1 , further comprising one or more types of inorganic fillers selected form the group consisting of clay, talc, silica, barium sulfate, aluminum hydroxide, potassium carbonate, magnesium carbonate, zeolite, zirconia, titania and montmorillonite. 
     
     
         8 . The composition for an encapsulant of  claim 1 , wherein a content of the photoinitiator is from 0.1% by weight to 10% by weight based on a total weight of the composition for an encapsulant. 
     
     
         9 . The composition for an encapsulant of  claim 1 , further comprising one or more types selected from the group consisting of acrylate-based monomers, methacrylate-based monomers, siloxane-based monomers, silicone-based monomers, silicone acrylate-based monomers and silicone urethane-based monomers. 
     
     
         10 . An encapsulant formed using the composition for an encapsulant of  claims 1 . 
     
     
         11 . An organic electronic device comprising the encapsulant of  claim 10 .