Pattern forming apparatus, method for disposing substrate, and method for manufacturing article

Abstract

A pattern forming apparatus which forms a pattern on a substrate, which includes a movable stage, a holding unit removably attached to the stage and configured to suck and hold the substrate, an optical system of which position with respect to the holding unit is fixed, and configured to detect an alignment mark of the substrate which is sucked by the holding unit from a suction surface side of the substrate, a reference mark for measuring a position of a detection field of the optical system, and a detection system configured to detect the reference mark. The substrate is disposed on the holding unit in accordance with the position of the reference mark detected by the detection system so that the alignment mark of the substrate detected from the suction surface side of the substrate by the optical system is disposed in the detection field of the optical system.

What is claimed is: 
     
         1 . A pattern forming apparatus which forms a pattern on a substrate, comprising:
 a stage which is movable;   a holding unit removably attached to the stage and configured to suck and hold the substrate;   an optical system of which position with respect to the holding unit is fixed, and configured to detect an alignment mark of the substrate which is sucked by the holding unit from a suction surface side of the substrate;   a reference mark for measuring a position of a detection field of the optical system; and   a detection system configured to detect the reference mark, wherein   the substrate is disposed on the holding unit in accordance with the position of the reference mark detected by the detection system so that the alignment mark of the substrate detected from the suction surface side of the substrate by the optical system is disposed in the detection field of the optical system.   
     
     
         2 . The pattern forming apparatus according to  claim 1 , wherein
 a plurality of reference marks are provided,   the detection system detects the plurality of reference marks, and   the pattern forming apparatus   obtains a position and an angle of the holding unit in accordance with a detection result of the plurality of reference marks by the detection system, and   disposes the substrate on the holding unit in accordance with the obtained position and the obtained angle of the holding unit.   
     
     
         3 . The pattern forming apparatus according to  claim 1 , wherein
 a plurality of optical systems are provided,   after the substrate is disposed on the holding unit, the plurality of optical systems detect a plurality of alignment marks of the substrate, obtain a position and an angle of the substrate,   perform alignment of the substrate in accordance with the obtained position and the obtained angle of the substrate, and form a pattern on the substrate.   
     
     
         4 . The pattern forming apparatus according to  claim 1 , wherein the reference mark is formed in a member which constitutes the holding unit. 
     
     
         5 . The pattern forming apparatus according to  claim 1 , wherein the reference mark is formed in member attached to the holding unit. 
     
     
         6 . The pattern forming apparatus according to  claim 1 , wherein the reference mark is formed in a tool substrate. 
     
     
         7 . The pattern forming apparatus according to  claim 1 , wherein the optical system is fixedly provided inside of the holding unit. 
     
     
         8 . The pattern forming apparatus according to  claim 7 , wherein the optical system is a relay optical system fixedly provided inside of the holding unit. 
     
     
         9 . A method of disposing a substrate on a holding unit using a pattern forming apparatus which forms a pattern on a substrate which includes
 a stage which is movable,   a holding unit removably attached to the stage and configured to suck and hold the substrate,   an optical system of which position with respect to the holding unit is fixed, and configured to detect an alignment mark of the substrate which is sucked by the holding unit from a suction surface side of the substrate, and   a detection system configured to detect a reference mark for measuring a position of a detection field of the optical system, wherein   the substrate is disposed on the holding unit in accordance with the position of the reference mark detected by the detection system so that the alignment mark of the substrate detected from the suction surface side of the substrate by the optical system is disposed in the detection field of the optical system.   
     
     
         10 . The method for disposing according to  claim 9 , wherein
 after replacing the holding unit, a reference mark for measuring a position of a detection field of the optical system is detected, and   the substrate is disposed on the holding unit in accordance with a position of the reference mark detected by the detection system.   
     
     
         11 . The method for disposing according to  claim 9 , wherein the substrate is disposed on the holding unit by controlling the stage in accordance with the position of the reference mark detected by the detection system so that the alignment mark of the substrate detected from suction surface side of the substrate by the optical system is disposed in the detection field of the optical system. 
     
     
         12 . The method for disposing according to  claim 9 , wherein the substrate is disposed on the holding unit by controlling a conveyance unit which conveys the substrate in accordance with the position of the reference mark detected by the detection system so that the alignment mark of the substrate detected from suction surface side of the substrate by the optical system is disposed in the detection field of the optical system. 
     
     
         13 . The method for disposing according to  claim 9 , wherein, after adjusting a position or an angle of the substrate by controlling a stage of a prealignment detecting unit including a stage which holds the substrate and a measurement unit which measures a position of the substrate, the substrate is conveyed from the prealignment detecting unit to the holding unit and the substrate is disposed on the holding unit. 
     
     
         14 . A method for manufacturing an article, comprising:
 forming a pattern on a substrate using a pattern forming apparatus; and   manufacturing an article by processing the substrate in which the pattern is formed,   wherein the pattern forming apparatus includes   a stage which is movable,   a holding unit removably attached to the stage and configured to suck and hold the substrate,   an optical system of which position with respect to the holding unit is fixed, and configured to detect an alignment mark of the substrate which is sucked by the holding unit from a suction surface side of the substrate,   a reference mark for measuring a position of a detection field of the optical system, and   a detection system configured to detect the reference mark, and   wherein the substrate is disposed on the holding unit in accordance with the position of the reference mark detected by the detection system so that the alignment mark of the substrate detected from the suction surface side of the substrate by the optical system is disposed in the detection field of the optical system.