Substrate support assembly

Abstract

An electrostatic chuck comprises a ceramic body having a first surface and a second surface that is on an opposite side of the ceramic body to the first surface, the ceramic body comprising a through-hole between the first surface and the second surface. The electrostatic chuck further comprises a thermally conductive base that supports the ceramic body and comprises a second hole that lines up with the through-hole, wherein the second hole is to fluidly couple to a source of heat transfer gas. The electrostatic chuck further comprises a bonding layer between the ceramic body and the thermally conductive base, the bonding layer comprising a space between an opening of the through-hole on the second surface and the gas introduction path.

What is claimed is: 
     
         1 . An electrostatic chuck comprising:
 a ceramic body having a first surface and a second surface that is on an opposite side of the ceramic body to the first surface, the ceramic body comprising a through-hole between the first surface and the second surface;   a thermally conductive base that supports the ceramic body and comprises a second hole that lines up with the through-hole, wherein the second hole is to fluidly couple to a source of heat transfer gas; and   a bonding layer between the ceramic body and the thermally conductive base, the bonding layer comprising a space between an opening of the through-hole on the second surface and an opening of the second hole.   
     
     
         2 . The electrostatic chuck of  claim 1 , wherein the bonding layer is formed from at least one of a silicone-based compound or an acrylic-based compound. 
     
     
         3 . The electrostatic chuck of  claim 2 , wherein at least one of the silicone-based compound or the acrylic-based compound comprises at least one of metal fillers or ceramic fillers. 
     
     
         4 . The electrostatic chuck of  claim 3 , wherein:
 the metal fillers are selected from a group consisting of Al, Mg, Ta and Ti; and   the ceramic fillers are selected from a group consisting of Al 2 O 3 , MN and TiB 2 .   
     
     
         5 . The electrostatic chuck of  claim 1 , further comprising:
 a gasket, disposed on the first surface or the second surface of the ceramic body, that encircles the through-hole.   
     
     
         6 . The electrostatic chuck of  claim 5 , wherein the gasket comprises a fluoro-polymer. 
     
     
         7 . The electrostatic chuck of  claim 5 , wherein the gasket comprises a fluoro-polymer compressible o-ring. 
     
     
         8 . The electrostatic chuck of  claim 5 , wherein the gasket is a cured liquid polymer. 
     
     
         9 . The electrostatic chuck of  claim 5 , wherein the gasket is between the ceramic body and the thermally conductive base. 
     
     
         10 . The electrostatic chuck of  claim 1 , wherein the ceramic body has a first ceramic material composition, the electrostatic chuck further comprising:
 a plasma resistant protective layer comprising a bulk sintered ceramic article having a second ceramic material composition that is different from the first ceramic material composition; and   a metal bond layer between the first surface of the ceramic body and the plasma resistant protective layer.   
     
     
         11 . The electrostatic chuck of  claim 10 , wherein the metal bond layer comprises:
 a first metal layer;   a second metal layer; and   a third metal layer between the first metal layer and the second metal layer, the third metal layer comprising a combination of at least two different metals.   
     
     
         12 . The electrostatic chuck of  claim 10 , further comprising:
 a third hole in the plasma resistant protective layer that lines up with the through-hole.   
     
     
         13 . The electrostatic chuck of  claim 10 , wherein a thickness of the metal bond layer is approximately 5-20 mil and a thickness of the plasma resistant protective layer is approximately 200-900 microns. 
     
     
         14 . The electrostatic chuck of  claim 10 , further comprising:
 a gasket, disposed on the ceramic body between the ceramic body and the plasma resistant protective layer, wherein the gasket encircles the through-hole.   
     
     
         15 . The electrostatic chuck of  claim 10 , wherein the second ceramic material composition is selected from a group consisting of Y x Al y O z  and a ceramic compound comprising Y 4 Al 2 O 9  and a solid-solution of Y 2 O 3 —ZrO 2 . 
     
     
         16 . The electrostatic chuck of  claim 1 , wherein the through-hole has a diameter of 5-7 mm. 
     
     
         17 . The electrostatic chuck of  claim 1 , further comprising:
 an electrode embedded in the ceramic body; and   an electrode connection, formed in the ceramic body, to electrically connect the electrode to at least one of a power source or a radio frequency source, the electrode connection comprising a hole filled with an electrically conductive material.   
     
     
         18 . The electrostatic chuck of  claim 1 , further comprising:
 a porous ceramic plug in the through-hole that plugs the through-hole, wherein the porous ceramic plug permits a flow of helium through the porous ceramic plug but prevents arcing of flowed plasma within the through-hole.   
     
     
         19 . The electrostatic chuck of  claim 1 , further comprising:
 a gasket at an outer perimeter of the first surface or the second surface of the ceramic body.   
     
     
         20 . The electrostatic chuck of  claim 1 , wherein:
 the ceramic body comprises MN or Al 2 O 3 ; and   the thermally conductive base comprises Al or stainless steel.