Inertial force sensor

Abstract

An inertial sensor includes oscillating-type angular velocity sensing element ( 32 ), IC ( 34 ) for processing signals supplied from angular velocity sensing element ( 32 ), capacitor ( 36 ) for processing signals, and package ( 38 ) for accommodating angular velocity sensing element ( 32 ), IC ( 34 ), capacitor ( 36 ). Element ( 32 ) and IC ( 34 ) are housed in package ( 38 ) via a vibration isolator, which is formed of TAB tape ( 46 ), plate ( 40 ) on which IC ( 34 ) is placed, where angular velocity sensing element ( 32 ) is layered on IC ( 34 ), and outer frame ( 44 ) placed outside and separately from plate ( 40 ) and yet coupled to plate ( 40 ) via wiring pattern ( 42 ).

1 . A sensor comprising:
 an angular velocity sensing element comprising;
 a first member comprising a first side, 
 a second member stacked on the first member, and 
 electrode pads disposed on a surface of the first member, the electrode pad aligned at only the first side of the first member; 
   an IC comprising;
 a first side positioned at the first side of the first member, 
 a second side opposite to the first side, 
 electrode pads aligned at the first side of the IC, and 
 electrode pads aligned at the second side of the IC; and 
   a package comprising an electrode pad,
 wherein one of the electrode pads at the first member are electrically connected to respective one of the electrode pads at the first side of the IC via a first wire, 
 wherein one of the electrode pads at the second side of the IC is electrically connected to the electrode pad at the package via a second wire, 
 wherein the first member is stacked above the IC, and 
 wherein the electrode pads at the first member are not covered by the second member. 
   
     
     
         2 . The sensor of  claim 1 , wherein
 the electrode pad at the sensing element is positioned higher than the electrode pads at the first side of the IC and the electrode pads at the second side of the IC, and   the electrode pads at the first side of the IC and the electrode pads at the second side of the IC are positioned higher than the electrode pad at the package.   
     
     
         3 . The sensor of  claim 1 , wherein
 the angular velocity sensing element is oscillating-type.   
     
     
         4 . The sensor of  claim 1 , wherein
 the sensing element is in contact with the IC.   
     
     
         5 . The sensor of  claim 1 , wherein
 each of the electrode pads at the sensing element is directly connected to respective one of the electrode pads at the first side of the IC via the first wire.   
     
     
         6 . The sensor of  claim 1 , wherein
 all of the electrode pads at the first side of the IC are aligned straight on a first single imaginary straight line parallel to the first side of the IC,   all of the electrode pads at the second side of the IC are aligned straight on a second single imaginary straight line parallel to the second side of the IC,   the IC has a third side perpendicular to the first side of the IC and a fourth side opposite to the third side, and   no electrode pads are presented in both of the third side and the fourth side of the IC.   
     
     
         7 . The sensor of  claim 1 , wherein
 an area of the upper surface of the first member is larger than an area of the upper surface of the second member in plan view.   
     
     
         8 . The sensor of  claim 1 , wherein
 the upper surface of the second member does not have a hole.   
     
     
         9 . The sensor of  claim 1 , wherein
 the first member is in contact with the second member.   
     
     
         10 . The sensor of  claim 1 , wherein
 a side surface of the first member and a side surface of the second member lie in the same plane at a portion connecting the first member and the second member.   
     
     
         11 . A sensor comprising:
 an angular velocity sensing element comprising;
 a first member comprising a first side, 
 a second member stacked on the first member, and 
 electrode pads disposed on a surface of the first member, the electrode pad aligned at only the first side of the first member; 
   an IC comprising;
 a first side positioned at the first side of the first member, 
 a second side opposite to the first side, 
 electrode pads aligned at the first side of the IC, and 
 electrode pads aligned at the second side of the IC; and 
   a package comprising an electrode pad,
 wherein one of the electrode pads at the first member are electrically connected to respective one of the electrode pads at the first side of the IC via a first wire, 
 wherein one of the electrode pads at the second side of the IC is electrically connected to the electrode pad at the package via a second wire, 
 wherein the first member is stacked above the IC, and 
 wherein a top surface of the first member is partially exposed from the second member, and the electrode pads at the first member are disposed on the partially exposed area of the first member. 
   
     
     
         12 . The sensor of  claim 11 , wherein
 the electrode pad at the sensing element is positioned higher than the electrode pads at the first side of the IC and the electrode pads at the second side of the IC, and   the electrode pads at the first side of the IC and the electrode pads at the second side of the IC are positioned higher than the electrode pad at the package.   
     
     
         13 . The sensor of  claim 11 , wherein
 the angular velocity sensing element is oscillating-type.   
     
     
         14 . The sensor of  claim 11 , wherein
 the sensing element is in contact with the IC.   
     
     
         15 . The sensor of  claim 11 , wherein
 each of the electrode pads at the sensing element is directly connected to respective one of the electrode pads at the first side of the IC via the first wire.   
     
     
         16 . The sensor of  claim 11 , wherein
 all of the electrode pads at the first side of the IC are aligned straight on a first single imaginary straight line parallel to the first side of the IC,   all of the electrode pads at the second side of the IC are aligned straight on a second single imaginary straight line parallel to the second side of the IC,   the IC has a third side perpendicular to the first side of the IC and a fourth side opposite to the third side, and   no electrode pads are presented in both of the third side and the fourth side of the IC.   
     
     
         17 . The sensor of  claim 11 , wherein
 an area of the upper surface of the first member is larger than an area of the upper surface of the second member in plan view.   
     
     
         18 . The sensor of  claim 11 , wherein
 the upper surface of the second member does not have a hole.   
     
     
         19 . The sensor of  claim 11 , wherein
 the first member is in contact with the second member.   
     
     
         20 . The sensor of  claim 11 , wherein
 a side surface of the first member and a side surface of the second member lie in the same plane at a portion connecting the first member and the second member.   
     
     
         21 . A sensor comprising:
 an angular velocity sensing element comprising;
 a first member comprising a first side, 
 a second member disposed on the first member, and 
 electrode pads disposed on a surface of the first member, the electrode pad aligned at only the first side of the first member; 
   an IC positioned beneath the first member comprising;
 a first side positioned at the first side of the first member, and 
 electrode pads aligned at the first side of the IC; and 
   a package positioned beneath the IC,
 wherein electrode pads at the first member are electrically connected to the electrode pads at the first side of the IC via wires, and 
 wherein a top surface of the first member is partially exposed from the second member, and the electrode pads at the first member are disposed on the partially exposed area of the first member. 
   
     
     
         22 . The sensor of  claim 21 , wherein
 the package further includes electrodes electrically connected to the IC.   
     
     
         23 . The sensor of  claim 22 , wherein
 One of the electrodes of the package includes a flat shaped portion positioned beneath the IC.   
     
     
         24 . The sensor of  claim 21 , wherein
 the angular velocity sensing element has a vibration frequency at around 22000 Hz.   
     
     
         25 . The sensor of  claim 21 , wherein
 a gravity center of the angular velocity sensing element and a gravity center of the IC are aligned on one axis.