US2017339786A1PendingUtilityA1

Suspension board with circuit and producing method thereof

Assignee: NITTO DENKO CORPPriority: Dec 11, 2015Filed: Aug 8, 2017Published: Nov 23, 2017
Est. expiryDec 11, 2035(~9.4 yrs left)· nominal 20-yr term from priority
H05K 1/0278H05K 3/44G11B 5/4846H05K 1/18H05K 1/11G11B 5/4853H05K 1/111H05K 1/0393H05K 3/4007G11B 5/4826H05K 2201/10151H05K 2201/10227H05K 1/05G11B 5/484H05K 1/181
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Claims

Abstract

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

Claims

exact text as granted — not AI-modified
1 .- 5 . (canceled) 
     
     
         6 . A method for producing a suspension board with circuit comprising:
 a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider,   wherein the base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal,   wherein a circumferential region not overlapped with the terminal region and around the terminal region,   wherein the thickness of the terminal region is thicker than that of the circumferential region,   wherein the base insulating layer includes:
 a first base insulating layer disposed at the one side in the thickness direction of the metal supporting board; and 
 a second base insulating layer covering the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board, 
   wherein the terminal region includes:
 a first terminal region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board, and 
 a second terminal region-insulating layer made of the second base insulating layer and disposed at one side in the thickness direction of the first terminal region-insulating layer, and 
   wherein the circumferential region includes at least a second circumferential region-insulating layer made of the second base insulating layer and disposed at the one side in the thickness direction of the metal supporting board;   the suspension board with circuit further comprising:   a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer and a pedestal supporting the slider,   wherein the pedestal includes:
 a first base pedestal layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board, 
 a second base pedestal layer made of the second base insulating layer and disposed at one side in the thickness direction of the first base pedestal layer, and 
 a cover pedestal layer made of the cover insulating layer and disposed at one side in the thickness direction of the second base pedestal layer; 
   the method comprising the steps of:   preparing the metal supporting board,   forming the first base insulating layer so as to dispose at least the first terminal region-insulating layer at the one side in the thickness direction of the metal supporting board and the first base pedestal layer at the one side in the thickness direction of the metal supporting board,   forming the second base insulating layer so as to dispose the second terminal region-insulating layer at the one side in the thickness direction of the first terminal region-insulating layer, the second circumferential region-insulating layer at the one side in the thickness direction of the metal supporting board, and the second base pedestal layer at the one side in the thickness direction of the first base pedestal layer,   forming the conductor layer including the connecting terminal at the one side in the thickness direction of the base insulating layer, and   forming the cover insulating layer exposing the connecting terminal and covering the conductor layer so as to dispose the cover pedestal layer at the one side in the thickness direction of the second base pedestal layer.   
     
     
         7 . A method for producing a suspension board with circuit comprising:
 a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider,   wherein the base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal,   wherein a circumferential region not overlapped with the terminal region and around the terminal region,   wherein the thickness of the terminal region is thicker than that of the circumferential region,   wherein the base insulating layer includes:
 a first base insulating layer disposed at the one side in the thickness direction of the metal supporting board; and 
 a second base insulating layer disposed at one side in the thickness direction of the first base insulating layer: 
   wherein the terminal region includes:
 a first terminal region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board; and 
 a second terminal region-insulating layer made of the second base insulating layer and disposed at one side in the thickness direction of the first terminal region-insulating layer, and 
   wherein the circumferential region includes at least a first circumferential region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board;   the suspension board with circuit further comprising:   a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer and a pedestal supporting the slider,   wherein the pedestal includes:
 a first base pedestal layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board; 
 a second base pedestal layer made of the second base insulating layer and disposed at one side in the thickness direction of the first base pedestal layer; and 
 a cover pedestal layer made of the cover insulating layer and disposed at one side in the thickness direction of the second base pedestal layer; 
   the method comprising the steps of:   preparing the metal supporting board,   forming the first base insulating layer so as to dispose the first terminal region-insulating layer at the one side in the thickness direction of the metal supporting board, the first circumferential region-insulating layer at the one side in the thickness direction of the metal supporting board, and the first base pedestal layer at the one side in the thickness direction of the metal supporting board,   forming the second base insulating layer so as to dispose at least the second terminal region-insulating layer at the one side in the thickness direction of the first terminal region-insulating layer and the second base pedestal layer at the one side in the thickness direction of the first base pedestal layer,   forming the conductor layer including the connecting terminal at the one side in the thickness direction of the base insulating layer, and   forming the cover insulating layer exposing the connecting terminal and covering the conductor layer so as to dispose the cover pedestal layer at the one side in the thickness direction of the second base pedestal layer.

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