Method for manufacturing chip-mounting substrate, and chip-mounting substrate

Abstract

A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

What is claimed is: 
     
         1 . A method for manufacturing a chip-mounting substrate, comprising:
 a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions;   an etching step of etching at least a portion of the precoat through a laser to form a pattern; and   a step of forming a metal layer on the substrate,   wherein the pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.   
     
     
         2 . The method of  claim 1 , wherein in the etching step, an uneven portion is formed on a region of an upper surface of the substrate corresponding to the pattern formed by the laser, and the metal layer is formed on an upper surface of the uneven portion. 
     
     
         3 . The method of  claim 1 , further comprising:
 a silver coating step of forming a silver coating on the substrate before the pre-coating step,   wherein in the etching step, an uneven portion is formed on a region of an upper surface of the silver coating corresponding to the pattern formed by the laser, and the metal layer is formed on an upper surface of the uneven portion.   
     
     
         4 . The method of  claim 1 , further comprising:
 a cavity formation step of forming a cavity on an upper surface of the substrate before the pre-coating step,   wherein in the etching step, the pattern is formed so as to be disposed in the cavity.   
     
     
         5 . The method of  claim 2 , further comprising:
 a cavity formation step of forming a cavity on an upper surface of the substrate before the pre-coating step,   
       wherein in the etching step, the pattern is formed so as to be disposed in the cavity. 
     
     
         6 . The method of  claim 3 , further comprising:
 a cavity formation step of forming a cavity on an upper surface of the substrate before the pre-coating step,   
       wherein in the etching step, the pattern is formed so as to be disposed in the cavity. 
     
     
         7 . The method of  claim 1 , wherein the metal layer is formed by plating, and further comprising:
 a step of removing the precoat after the step of forming the metal layer.   
     
     
         8 . The method of  claim 2 , wherein the metal layer is formed by plating, and further comprising:
 a step of removing the precoat after the step of forming the metal layer.   
     
     
         9 . The method of  claim 3 , wherein the metal layer is formed by plating, and further comprising:
 a step of removing the precoat after the step of forming the metal layer.   
     
     
         10 . A chip-mounting substrate, comprising:
 a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions; and   a metal layer disposed on at least one of the conductive portions,   wherein the metal layer is formed on an uneven portion formed on the substrate by irradiation of laser light.   
     
     
         11 . The substrate of  claim 10 , wherein an uneven portion having a shape corresponding to the shape of the uneven portion formed on the substrate is formed on an upper surface of the metal layer. 
     
     
         12 . The substrate of  claim 10 , wherein at least a portion of the uneven portion is formed to make a closed curve. 
     
     
         13 . The substrate of  claim 11 , wherein at least a portion of the uneven portion is formed to make a closed curve. 
     
     
         14 . The substrate of  claim 10 , wherein a silver coating is formed between upper surfaces of the conductive portions and the metal layer, and the uneven portion is formed on the silver coating. 
     
     
         15 . The substrate of  claim 11 , wherein a silver coating is formed between upper surfaces of the conductive portions and the metal layer, and the uneven portion is formed on the silver coating.