Heat insulator
Abstract
A heat insulator including a porous sintered body having a porosity of 70 vol % or more, pores having a pore size of more than 1000 μm in a proportion of 10 vol % or less of all pores and pores having a pore size of 0.8 μm or more and less than 10 μm occupy 50 vol % or more and 80 vol % or less of pores having a pore size of 1000 μm or less, while pores having a pore size of 0.01 μm or more and less than 0.8 μoccupy 10 vol % or more and 30 vol % or less pores having a pore size of 1000 μm or less. The porous sintered body is formed from MgAl 2 O 4 raw material and includes a fibrous layer formed from inorganic material fibers, the heat conductivity of the heat insulator at 1000° C. or more and 1500° C. or less being 0.40 W/m·K) or less.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat insulator comprising a porous sintered body having a porosity of 70% or more,
the porous sintered body including a spinel sintered body formed from an mgAl 2 O 4 and a fibrous layer formed from fibers formed of an inorganic material on at least one surface of the spinel sintered body, the porous sintered body having pores having a pore size of more than 1000 μm in a proportion of 10 vol % or less of all the pores, pores having a pore size of 0.8 μm or more and less than 10 μm occupying 50 vol % or more and 80 vol % or less of the pores having a pore size of 1000 μm or less, while pores having a pore size of 0.01 μm or more and less than 0.8 μm occupying 10 vol % or more and 30 vol % or less of the pores having a pore size of 1000 μm or less, the fibers in the fibrous layer having a silica component content of 55 wt % or less, and the heat conductivity of the heat insulator at 1000° C. or more and 1500° C. or less being 0.40 W/(m·K) or less.Join the waitlist — get patent alerts
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