Method of forming a wavelength converted light emitting device

Abstract

A method according to embodiments of the invention includes disposing a support layer on a surface of a wavelength converting ceramic wafer. The wavelength converting ceramic wafer and the support layer are diced to form wavelength converting members. A wavelength converting member is attached to a light emitting device. After attaching the wavelength converting member to the light emitting device, the support layer is removed.

What is claimed is: 
     
         1 . A device comprising:
 a light emitting device; and   a wavelength converting ceramic disposed in a path of light emitted by the light emitting device, wherein the wavelength converting ceramic has a thickness between 10 μm and 100 μm.   
     
     
         2 . The device of  claim 1  wherein the wavelength converting ceramic has a thickness between 50 μm and 70 μm. 
     
     
         3 . The device of  claim 1  further comprising a reflective material disposed around the light emitting device, wherein a top surface of the reflective material is at the same height as a top surface of the wavelength converting ceramic. 
     
     
         4 . The device of  claim 1  wherein the wavelength converting ceramic is a preformed member, formed separately from the light emitting device.