Semiconductor refrigerator

Abstract

The present invention is related to a semiconductor refrigerator. The semiconductor refrigerator comprising a semiconductor cooling plate and a hot end heat radiating device, wherein the hot end heat radiating device comprises multiple sintered heat pipes, each having a main pipe with both ends closed, wherein the main pipe comprises a first pipe segment thermally connected with a hot end of the semiconductor cooling plate, and a second pipe segment, which is located above the first pipe segment, and from whose one or more portions extend one or more manifolds to radiate heat from the hot end of the semiconductor cooling plate to an ambient environment.

What is claimed is: 
     
         1 . A semiconductor refrigerator, comprising a semiconductor cooling plate and a hot end heat radiating device;
 wherein the hot end heat radiating device comprises multiple sintered heat pipes, each having a main pipe with both ends closed;   wherein the main pipe comprises a first pipe segment thermally connected with a hot end of the semiconductor cooling plate, and a second pipe segment, which is located above the first pipe segment, and from whose one or more portions extend one or more manifolds to radiate heat from the hot end of the semiconductor cooling plate to an ambient environment.   
     
     
         2 . The semiconductor refrigerator of  claim 1 , wherein the first pipe segment of the main pipe is formed by extending from a lower end of the main pipe vertically upwards by a predetermined length; and
 the first pipe segments of multiple main pipes are located in the same plane in parallel and with gaps therebetween, the plane being parallel with a rear wall of an inner tank of the semiconductor refrigerator.   
     
     
         3 . The semiconductor refrigerator of  claim 1 , wherein the hot end heat radiating device further comprises:
 a fixed bottom plate whose front surface is thermally connected with the hot end of the semiconductor cooling plate and whose rear surface is provided with one or more grooves; and   a fixed cover plate whose front surface is provided with one or more grooves and which is configured to cooperate with the fixed bottom plate to clamp the first pipe segment of the main pipe between the grooves of the fixed cover plate and of the fixed bottom plate.   
     
     
         4 . The semiconductor refrigerator of  claim 1 , wherein the second pipe segment of the main pipe is formed by extending from an upper end of the main pipe vertically downwards by a predetermined length, and the second pipe segments of multiple main pipes are located in the same plane in parallel and with gaps therebetween, the plane being parallel with the rear wall of the inner tank of the semiconductor refrigerator; or
 the second pipe segment of the main pipe is formed by extending from the upper end of the main pipe longitudinally forwards by a predetermined length and then vertically downwards by a predetermined length, the vertical portions of the second pipe segments of the multiple main pipes are located in the same plane in parallel and with gaps therebetween, the plane being parallel with the rear wall of the inner tank of the semiconductor refrigerator, and a starting end of the manifold of the sintered heat pipe is located at the vertical portion of a corresponding second pipe segment.   
     
     
         5 . The semiconductor refrigerator of  claim 1 , wherein the manifold of the sintered heat pipe is perpendicular to the rear wall of the inner tank. 
     
     
         6 . The semiconductor refrigerator of  claim 1 , wherein the manifolds of each sintered heat pipe are located at the same side of the corresponding main pipe, or are located at the opposite sides of the corresponding main pipe respectively. 
     
     
         7 . The semiconductor refrigerator of  claim 6 , wherein the hot end heat radiating device further comprises: one or two fin groups, each fin group comprising multiple corresponding plate fins which are arranged in parallel and with gaps therebetween, and each fin group being installed at a manifold on a corresponding side of the main pipe via pipe holes of the respective plate fins. 
     
     
         8 . The semiconductor refrigerator of  claim 7 , wherein the hot end heat radiating device further comprises: a blower arranged at a transverse side of or above the multiple manifolds and configured such that an air inlet area of the blower sucks air flow and the air flow is blown to a gap between each two adjacent plate fins, or the air flow is sucked from the gap between each two adjacent plate fins and is then blown to the air inlet area. 
     
     
         9 . The semiconductor refrigerator of  claim 7 , wherein the middle portion of each plate fin is provided with a receiving through hole so that each fin group defines a receiving space extending along the axes of the receiving through holes; and
 the hot end heat radiating device further comprises one or two blowers respectively provided in the receiving spaces of the corresponding fin groups and configured such that air flow is sucked from an air inlet area of each blower and is blown to a gap between each two adjacent plate fins of the corresponding fin group.   
     
     
         10 . The semiconductor refrigerator of  claim 5 , wherein the hot end heat radiating device further comprises: multiple spiral fins each spirally installed on a corresponding manifold, and a blower arranged at a transverse side of or above the multiple manifolds such that the manifolds of each sintered heat pipe are located at an air inlet area or an air sucking area of the blower.