Adhesive compounds containing getter materials that can be activated

Abstract

An adhesive comprising a getter material and optionally a solvent comprising a catalyst activatable by means of an external stimulus for the reaction of the getter material with a permeate can tolerate brief contact with permeates such as moisture in particular before user application, without any significant impairment of getter capacity.

1 . Adhesive comprising
 a getter material and   optionally a solvent,   wherein the adhesive comprises a catalyst activatable by means of an external stimulus for the reaction of the getter material with a permeate.   
     
     
         2 . Adhesive according to  claim 1 , wherein the permeate is water. 
     
     
         3 . Adhesive according to  claim 1 , wherein the getter is present in an amount of at least 2% by weight. 
     
     
         4 . Adhesive according to  claim 1 , wherein the amount of catalyst is less than 5% by weight. 
     
     
         5 . Adhesive according to  claim 1 , wherein the external stimulus is UV radiation, a temperature change, microwave radiation or visible light. 
     
     
         6 . Adhesive according to  claim 1 , wherein the catalyst activatable by an external stimulus is a latent acid or a latent base. 
     
     
         7 . Adhesive according to  claim 1 , wherein the adhesive comprises an adhesive base composed of
 at least one polymer, and   at least one tackifying resin.   
     
     
         8 . Adhesive according to  claim 7 , wherein the adhesive base further comprises at least one reactive resin having at least one curable group. 
     
     
         9 . Adhesive according to  claim 7 , wherein the adhesive is a barrier adhesive, and the adhesive base, if a reactive resin is present, has a water vapor permeation rate after curing of less than 100 g/m 2 d. 
     
     
         10 . Adhesive according to  claim 1 , wherein the getter material is at least one compound selected from the group consisting of ethoxysilanes. 
     
     
         11 . Adhesive according to  claim 10 , wherein the ethoxysilane additionally comprises at least one polymerizable group. 
     
     
         12 . Adhesive according to  claim 1 , wherein the catalyst is a latent acid or a latent base. 
     
     
         13 . Adhesive according to  claim 8 , wherein the adhesive base optionally comprises a reactive resin and the polymerizable group is polymerizable with those of the reactive. 
     
     
         14 . Adhesive according to  claim 1 , wherein the getter material is at least one compound selected from the group consisting of nonaromatic carbodiimides. 
     
     
         15 . Adhesive according to  claim 1 , wherein the getter material is at least one compound selected from the group consisting of acid- and/or base-hydrolysable esters. 
     
     
         16 . Adhesive according to  claim 1 , wherein the getter material is at least one compound selected from the group consisting of the oxazolidines. 
     
     
         17 . Adhesive according to  claim 16 , wherein the catalyst is a latent base. 
     
     
         18 . Adhesive according to  claim 1 , wherein the getter material is at least one compound selected from the group consisting of the isocyanates. 
     
     
         19 . Adhesive according to  claim 18 , wherein the catalyst is a latent base. 
     
     
         20 . Adhesive according to  claim 1 , wherein the getter material is at least one compound selected from the group consisting of the anhydrides. 
     
     
         21 . Adhesive according to  claim 20 , wherein the catalyst is a latent acid. 
     
     
         22 . Adhesive according to  claim 8 , wherein the at least one curable group is at least one group selected from the group consisting of cyclic ether, vinyl, acrylate, methacrylate, hydroxyl, amino and isocyanate. 
     
     
         23 . Adhesive according to  claim 1 , wherein the adhesive is a pressure-sensitive adhesive. 
     
     
         24 . Adhesive tape comprising an adhesive according to  claim 1 . 
     
     
         25 . Method for encapsulation of assemblies in organic electronics, which comprises encapsulating said assemblies with the adhesive of  claim 1 . 
     
     
         26 . Method for applying an adhesive of  claim 1  comprising the steps of
 applying the adhesive to the article to be bonded; 
 activating the getter material by means of an external stimulus. 
 
     
     
         27 . Method according to  claim 26 , wherein the adhesive comprises a reactive resin and the external stimulus induces not only the activation of the getter material but also the curing of the adhesive. 
     
     
         28 . Method for protecting an organic electronic arrangement disposed on a substrate, wherein a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, wherein the cover is additionally bonded over at least part of the area on the substrate and/or on the electronic arrangement,
 wherein the bonding is brought about by means of at least one layer of an adhesive according to  claim 1 .   
     
     
         29 . Method according to  claim 28 , wherein
 the adhesive takes the form of a layer of an adhesive tape.   
     
     
         30 . Method according to  claim 28 , wherein the adhesive layer, optionally as a constituent of a double-sided adhesive tape comprising further layers, is applied first, and in a subsequent step the cover is applied to the substrate and/or the electronic arrangement. 
     
     
         31 . Method according to  claim 30 , wherein,
 the adhesive layer and the cover are applied together to the substrate and/or the electronic arrangement.   
     
     
         32 . Method according to  claim 28 , wherein
 the fully covers the electronic arrangement.   
     
     
         33 . Method according to  claim 28 , wherein
 a region of the substrate around the electronic arrangement is also wholly or partly covered by the cover.   
     
     
         34 . Method for encapsulation of assemblies in organic electronics, which comprises encapsulating said assemblies with the adhesive tape of  claim 24 . 
     
     
         35 . Method for applying an adhesive tape of  claim 24 , comprising the steps of
 applying the adhesive tape to the article to be bonded;   activating the getter material by means of an external stimulus.