Chemical mechanical polishing apparatus for polishing workpiece

Abstract

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad ( 2 ) having an annular polishing surface ( 2 a ) which has a curved vertical cross-section; a workpiece holder ( 11 ) for holding a workpiece (W) having a polygonal shape; a rotating device ( 15 ) configured to rotate the workpiece holder ( 11 ) about an axis of the workpiece (W); a pressing device ( 14 ) configured to press a periphery of the workpiece (W) against the annular polishing surface ( 2 a ); and an operation controller ( 25 ) configured to change a speed at which the rotating device ( 15 ) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device ( 14 ) is disposed more inwardly than the workpiece holder ( 11 ) in a radial direction of the polishing table ( 3 ).

1 . A chemical mechanical polishing apparatus for polishing a workpiece having a polygonal shape, comprising:
 a polishing pad having an annular polishing surface which has a curved vertical cross-section;   a rotatable polishing table supporting the polishing pad;   a workpiece holder for holding the workpiece;   a rotating device configured to rotate the workpiece holder about an axis of the workpiece;   a pressing device configured to press a periphery of the workpiece against the annular polishing surface;   a polishing-liquid supply nozzle configured to supply a polishing liquid onto the annular polishing surface; and   an operation controller configured to change a speed at which the rotating device rotates the workpiece according to a rotation angle of the workpiece,   wherein the pressing device is disposed more inwardly than the workpiece holder in a radial direction of the polishing table.   
     
     
         2 . The chemical mechanical polishing apparatus according to  claim 1 , further comprising:
 a polished-state monitoring device configured to monitor a polished state of the periphery of the workpiece.   
     
     
         3 . The chemical mechanical polishing apparatus according to  claim 1 , wherein the polishing pad has an annular shape, and the polishing pad has an inner peripheral surface which constitutes the annular polishing surface.