Header for a medical implant device, particularly for a pacemaker

Abstract

A header for a medical implant device is configured to provide an electrical connection to a circuit within the housing of the medical implant device. The header includes at least one circuit board; a header housing enclosing the circuit board and configured to be connected to the housing of the medical implant device; and a sensor system on the circuit board.

What is claimed is: 
     
         1 . A header ( 1 ) for a medical implant device ( 2 ), the medical implant device ( 2 ) having a housing ( 4 ) with a device circuit ( 40 ) therein, wherein:
 a. the header ( 1 ) includes:
 (1) a header housing ( 10 ) configured to be connected to the housing ( 4 ) of the medical implant device ( 2 ), 
 (2) a circuit board ( 20 ) enclosed within the header housing ( 10 ), the circuit board ( 20 ) having a sensor system ( 30 ) thereon, 
   b. the header ( 1 ) is configured to provide an electrical connection between the circuit board ( 20 ) and the device circuit ( 40 ) of the medical implant device ( 2 ).   
     
     
         2 . The header ( 1 ) of  claim 1  wherein the sensor system ( 30 ) is configured to measure at least one of the following quantities:
 a. a quantity related to patient health status, 
 b. blood glucose concentration, 
 c. blood pressure, 
 d. blood oxygen concentration, 
 e. temperature, 
 f. acceleration, 
 g. patient posture, 
 h. respiration, 
 i. sound, 
 j. magnetic field characteristics, 
 k. electromagnetic field characteristics. 
 
     
     
         3 . The header ( 1 ) of  claim 1  further including at least one antenna ( 28 ):
 a. configured to receive or transmit signals, and 
 b. provided on the circuit board ( 20 ). 
 
     
     
         4 . The header ( 1 ) of  claim 3  wherein the antenna ( 28 ) is defined by layers spaced at different locations across a thickness of the circuit board ( 20 ). 
     
     
         5 . The header ( 1 ) of  claim 1  further including a connector ( 50   a ,  50   b ):
 a. connected to the circuit board ( 20 ), and 
 b. configured to electrically connect a lead to the circuit board ( 20 ). 
 
     
     
         6 . The header ( 1 ) of  claim 5  wherein the connector ( 50   a ,  50   b ) is defined by one of:
 a. a DF-4 connector ( 50   b ), 
 b. an IS-4 connector, 
 c. a DF-1 connector, and 
 d. an IS-1 connector ( 50   a ). 
 
     
     
         7 . The header ( 1 ) of  claim 5  further including a connector contact member ( 51 ,  53 ) electrically connecting the connector ( 50   a ,  50   b ) to the circuit board ( 20 ). 
     
     
         8 . The header ( 1 ) of  claim 7  wherein the connector contact member ( 51 ,  53 ) extends from the circuit board ( 20 ) along a plane at least substantially parallel to or coincident with a board plane in which a major portion of the circuit board ( 20 ) is situated. 
     
     
         9 . The header ( 1 ) of  claim 8  wherein:
 a. an aperture ( 203 ) is defined within the circuit board ( 20 ), and 
 b. the connector contact member ( 51 ) extends from the circuit board ( 20 ) across the aperture ( 203 ). 
 
     
     
         10 . The header ( 1 ) of  claim 8  wherein:
 a. the circuit board ( 20 ) is bounded by a board perimeter in the board plane, 
 b. the connector contact member ( 53 ):
 (1) extends from the board perimeter, and 
 (2) connects to the connector ( 50   a ) at a location spaced from the board perimeter. 
 
 
     
     
         11 . The header ( 1 ) of  claim 8  wherein the circuit board ( 20 ):
 a. extends along the board plane between opposing first and second board ends ( 21 ,  22 ), 
 b. includes contact pads ( 27 ) situated at or adjacent the first board end ( 21 ), the contact pads ( 2 ) being electrically connected to the circuit board ( 20 ), 
 c. the connector ( 50   a ) is connected to the circuit board ( 20 ) at or adjacent the second board end ( 22 ). 
 
     
     
         12 . The header ( 1 ) of  claim 11  wherein:
 a. an aperture ( 203 ) is defined within the circuit board ( 20 ) between the first and second board ends ( 21 ,  22 ), and 
 b. a second connector ( 50   b ) is:
 (1) situated within or adjacent the aperture ( 203 ), and 
 (2) connected to the circuit board ( 20 ) 
 
 
     
     
         13 . The header ( 1 ) of  claim 5  wherein the circuit board ( 20 ) has indicia defined on a discrete subsection of the circuit board ( 20 ), the indicia identifying a characteristic of the connector ( 50   a ,  50   b ). 
     
     
         14 . The header ( 1 ) of  claim 1  wherein the circuit board ( 20 ) includes an x-ray marker ( 26 ) configured to generate a defined contrast in an x-ray image of the header ( 1 ). 
     
     
         15 . The header ( 1 ) of  claim 1  wherein the circuit board ( 20 ) includes a filter configured to reduce electromagnetic interference in electrical signals traveling within the circuit board ( 20 ). 
     
     
         16 . The header ( 1 ) of  claim 1  further including a converter configured to convert MRI energy received by header ( 1 ) into photonic energy. 
     
     
         17 . The header ( 1 ) of  claim 1  wherein casted material ( 205 ) encapsulates the circuit board ( 20 ) within the header housing ( 10 ). 
     
     
         18 . The header ( 1 ) of  claim 1  further including a medical implant device ( 2 ) having a housing ( 4 ) with a device circuit ( 40 ) therein, wherein the header housing ( 10 ) is connected to the housing ( 4 ) of the medical implant device ( 2 ). 
     
     
         19 . The header ( 1 ) of  claim 16  wherein:
 a. the circuit board ( 20 ) has a header circuit ( 210 ) thereon configured to control the medical implant device ( 2 ), and 
 b. the device circuit ( 40 ) in the housing ( 4 ) includes at least one of:
 (1) a battery configured to power stimulation pulses, and 
 (2) a capacitor configured to generate stimulation pulses. 
 
 
     
     
         20 . A combination medical implant device ( 2 ) and header ( 1 ) including:
 a. a medical implant device ( 2 ) having a housing ( 4 ) with a device circuit ( 40 ) therein, the device circuit ( 40 ) including at least one of:
 (1) a battery configured to power stimulation pulses, and 
 (2) a capacitor configured to generate stimulation pulses, 
   b. a header ( 1 ) for the medical implant device ( 2 ), the header ( 1 ) including:
 (1) a header housing ( 10 ) configured to connect to the housing ( 4 ) of the medical implant device ( 2 ), and 
 (2) a circuit board ( 20 ) enclosed within the header housing ( 10 ), the circuit board ( 20 ) having a header circuit ( 210 ) thereon configured to control the device circuit ( 40 ) of the medical implant device ( 2 ), 
 wherein the header ( 1 ) provides an electrical connection between the header circuit ( 210 ) and the device circuit ( 40 ) of the medical implant device ( 2 ) when the header housing ( 10 ) is connected to the housing ( 4 ) of the medical implant device ( 2 ).