US2017309784A1PendingUtilityA1
Substrate for semiconductor light emitting device and semiconductor light emitting device, and manufacturing methods thereof
Est. expiryAug 21, 2032(~6.1 yrs left)· nominal 20-yr term from priority
H10P 50/695H10P 50/692H10P 90/126H10P 14/6344H10P 14/6342H10P 14/3416H10P 14/3402H10P 14/2925H10P 14/2921H10P 14/2901H10P 14/36H10P 14/24H10P 50/242H01L 21/02285H01L 21/0237H01L 21/0262H01L 21/02521H01L 21/3086H01L 21/3081H01L 21/02019H01L 21/0242H01L 21/0243H01L 33/50H01L 2933/0025H01L 21/02282H01L 33/20H01L 21/0254H01L 33/007H01L 21/02658H01L 33/0066H10H 20/819H10H 20/034H10H 20/01335H10H 20/851H10H 20/0133H10H 20/036H10H 20/01H10H 20/82
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Claims
Abstract
A method of manufacturing a semiconductor light emitting device, the method including arranging multiple particles M in a monolayer on a substrate S, dry etching the multiple particles M arranged to provide a void between the particles M in a condition by which the particles M are etched while the substrate S is not substantially etched; and dry etching the substrate S by using the multiple particles M 1 after the particle etching as an etching mask, thereby forming an uneven structure on one surface X the substrate S.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing a semiconductor light emitting device substrate, the method comprising:
arranging a plurality of particles in a monolayer on an upper surface of a substrate to form a monolayer particle film; dry etching said plurality of particles arranged to provide a void between the particles in a condition in which said particles are etched while said substrate is not substantially etched; and etching said upper surface using said monolayer particle film as a mask, wherein in said substrate etching, a step-like structure is formed in a region that is exposed in the upper surface of said substrate after said particle etching.
2 . The method of manufacturing a semiconductor light emitting device substrate according to claim 1 , wherein in said substrate etching, of the plurality of particles, the larger a void between two particles, the smaller said step-like structure.
3 . The method of manufacturing a semiconductor light emitting device substrate according to claim 2 , wherein in said particle arranging, said plurality of particles are arranged by a Langmuir-Blodgett (LB) method.
4 . A method of manufacturing a semiconductor light emitting device, the method comprising:
forming a semiconductor light emitting device substrate by the method according to claim 1 ; and forming a light emitting structure including a semiconductor layer on said upper surface where said step-like structure is formed in said semiconductor light emitting device substrate.
5 . A method of manufacturing a semiconductor light emitting device, the method comprising:
obtaining a light emitting device substrate by the manufacturing method according to claim 1 ; and laminating a semiconductor functional layer including at least a light emitting layer on a surface of the obtained light emitting device substrate where an uneven structure is formed.Join the waitlist — get patent alerts
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