Directly Cooled Substrates for Semiconductor Modules

Abstract

A semiconductor module includes a substrate having a metallized first side and a metallized second side opposing the metallized first side. A semiconductor die is attached to the metallized first side of the substrate. A plurality of cooling structures are welded to the metallized second side of the substrate. Each of the cooling structures includes a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. The substrate can be electrically conductive or insulating. Corresponding methods of manufacturing such semiconductor modules and substrates with such welded cooling structures are also provided.

What is claimed is: 
     
         1 . A semiconductor module support member, comprising:
 a substrate having a metallized side; and   a plurality of cooling structures welded to the metallized side of the substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate.   
     
     
         2 . The semiconductor module support member of  claim 1 , wherein at least some of the weld beads have a curved exterior surface. 
     
     
         3 . The semiconductor module support member of  claim 1 , wherein one or more weld beads of at least some of the cooling structures are non-uniformly shaped with respect to the other weld beads in the same cooling structure. 
     
     
         4 . The semiconductor module support member of  claim 1 , wherein the weld bead of each cooling structure disposed furthest from the substrate has a proximal end welded to the weld bead next furthest from the substrate and a rounded distal end. 
     
     
         5 . The semiconductor module support member of  claim 1 , wherein the substrate comprises an isolation material having a first metallized side and a second metallized side opposing the first metallized side, and wherein the cooling structures are welded to one of the metallized sides of the isolation material. 
     
     
         6 . The semiconductor module support member of  claim 1 , wherein the metallized side of the substrate and the weld beads comprise aluminum. 
     
     
         7 . The semiconductor module support member of  claim 1 , wherein at least some of the stacked arrangements of weld beads are columnar. 
     
     
         8 . The semiconductor module support member of  claim 7 , wherein at least some of the columnar stacked arrangements of weld beads have different diameters and lengths. 
     
     
         9 . The semiconductor module support member of  claim 1 , wherein a first end of each stacked arrangement is attached to the metallized side and a second end of each stacked arrangement is free standing. 
     
     
         10 . A semiconductor module, comprising:
 a substrate having a metallized first side and a metallized second side opposing the metallized first side;   a semiconductor die attached to the metallized first side of the substrate; and   a plurality of cooling structures welded to the metallized second side of the substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate.   
     
     
         11 . The semiconductor module of  claim 10 , further comprising a cooler attached to a periphery of the metallized second side of the substrate, the periphery being free of the cooling structures, wherein the cooling structures extend away from the substrate into a recessed region of the cooler. 
     
     
         12 . The semiconductor module of  claim 11 , further comprising a mold compound encapsulating the semiconductor die at the metallized first side of the substrate. 
     
     
         13 . The semiconductor module of  claim 10 , further comprising:
 a mold compound encapsulating the semiconductor die and the substrate;   an additional substrate embedded in the mold compound above the metallized first side of the substrate and spaced apart from the semiconductor die by part of the mold compound, the additional substrate having a first side facing the semiconductor die and an opposing second side; and   a plurality of cooling structures welded to the second side of the additional substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the additional substrate,   wherein the cooling structures welded to the second side of each substrate protrude out of the mold compound.   
     
     
         14 . The semiconductor module of  claim 10 , wherein the metallized second side of the substrate and the weld beads comprise aluminum. 
     
     
         15 . The semiconductor module of  claim 10 , wherein the metallized first side of the substrate comprises a different material than the metallized second side of the substrate, and wherein the weld beads comprise the same material as the metallized second side. 
     
     
         16 . The semiconductor module of  claim 10 , wherein the plurality of cooling structures is electrically isolated from the semiconductor die by the substrate. 
     
     
         17 . The semiconductor module of  claim 10 , wherein a first end of each stacked arrangement is attached to the metallized side and a second end of each stacked arrangement is free standing.