Package and method of manufacturing the same

Abstract

The method of manufacturing a package comprising: preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and via pads which are connected to one ends of plated tails which are divided to be disconnected in the dicing region; mounting at least one electronic component on at least one surface of each package region of the substrate; forming a connection pattern having conductivity in disconnected portions of the plated tails to form electrical connections therebetween; forming a molded part on the surface of the substrate to enclose the electronic component; forming at least one via penetrating through the molded part by applying current through the plated tails; and dicing the substrate in the dicing region to divide the substrate into separate packages, each having the connection pattern exposed to the exterior of the substrate.

What is claimed is: 
     
         1 . A method of manufacturing a package, the method comprising:
 preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and via pads which are connected to one ends of plated tails which are divided to be disconnected in the dicing region;   mounting at least one electronic component on at least one surface of each package region of the substrate;   forming a connection pattern having conductivity in disconnected portions of the plated tails to form electrical connections therebetween;   forming a molded part on the surface of the substrate to enclose the electronic component;   forming at least one via penetrating through the molded part by applying current through the plated tails; and   dicing the substrate in the dicing region to divide the substrate into separate packages, each having the connection pattern exposed to the exterior of the substrate.   
     
     
         2 . The method of  claim 1 , wherein the forming of the via includes:
 forming a via hole penetrating through the molded part to expose the via pad; and   forming the via by applying the current through the plated tail connected to the via pad to allow the via hole to be filled with an electroplating layer.   
     
     
         3 . The method of  claim 1 , wherein the connection pattern having conductivity becomes nonconductive by the dicing of the substrate in the dicing region. 
     
     
         4 . The method of  claim 1 , wherein the dicing of the substrate in the dicing region is performed using a router, a blade, a laser, or combinations thereof. 
     
     
         5 . The method of  claim 1 , further comprising removing conductivity from the exposed portion of the connection pattern after the dividing of the substrate into the separate packages. 
     
     
         6 . The method of  claim 1 , wherein the connection pattern is formed to be co-planar with the via pad. 
     
     
         7 . The method of  claim 1 , wherein the substrate has at least one circuit pattern extended from the separate package region to the dicing region; and
 the circuit pattern is exposed to the exterior of the separate package by the dicing of the substrate in the dicing region.   
     
     
         8 . The method of  claim 7 , wherein the circuit pattern is a ground electrode. 
     
     
         9 . The method of  claim 8 , wherein the ground electrode is formed to be elongated on an edge of the separate package region. 
     
     
         10 . The method of  claim 7 , further comprising forming a shielding part to cover at least a portion of the separate package after the dividing of the substrate into the separate packages,
 wherein the shielding part is electrically connected to the exposed portion of the circuit pattern.   
     
     
         11 . A method of manufacturing a package, the method comprising:
 preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and one or more circuit layers which are connected to one ends of plated tails which are divided to be disconnected in the dicing region;   mounting at least one electronic component on at least one surface of each package region of the substrate;   forming a connection pattern having conductivity in disconnected portions of the plated tails to form electrical connections therebetween;   forming a molded part on the surface of the substrate to enclose the electronic component;   forming at least one via penetrating through the molded part by applying current to the circuit layer connected to one ends of the plated tails through the plated tails;   dicing the substrate in the dicing region to divide the substrate into separate packages, each having the connection pattern exposed to the exterior of the substrate;   mounting a solder bump on the via; and   mounting a lower package on the solder bump.