Resin composition, method for producing heat-resistant resin film, and display device

Abstract

A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

1 . A resin composition which is configured such that, when the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range from 200 to 350° C., the resin composition film forms a heat-resistant resin film having a light transmittance of 50% or more at a wavelength of 365 to 436 nm before the heat treatment and having a light transmittance of 10% or less at a wavelength of 365 to 436 nm after the heat treatment. 
     
     
         2 . The resin composition according to  claim 1 , wherein, when the resin composition is formed into a resin composition film having a thickness of 2.0 μm after a heat treatment at a temperature within the range from 200 to 350° C., the resin composition film forms a heat-resistant resin film having a light transmittance of 50% or more at a wavelength of 365 to 436 nm before the heat treatment and having a light transmittance of 5% or less at a wavelength of 350 to 460 nm after the heat treatment. 
     
     
         3 . The resin composition according to  claim 1 , additionally containing a photo-acid generator and having positive-working photosensitivity. 
     
     
         4 . A resin composition having positive-working photosensitivity and comprising (A1) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (A3) a phenolic resin and/or a polyhydroxystyrene resin, (B) a thermally color-developing compound, (C) a photo-acid generator, and (D) a solvent, wherein the component (A3) is contained in an amount of 5 to 50 parts by weight inclusive relative to 100 parts by weight of the component (A1). 
     
     
         5 . A resin composition having positive-working photosensitivity and comprising (A2) a resin having such a backbone structure that two cyclic structures are bonded to a cyclic-structure-constituting quaternary carbon atom, (A3) a phenolic resin and/or a polyhydroxystyrene resin, (B) a thermally color-developing compound, (C) a photo-acid generator, and (D) a solvent, wherein the component (A3) is contained in an amount of 5 to 50 parts by weight inclusive relative to 100 parts by weight of the component (A2). 
     
     
         6 . The resin composition according to  claim 4 , wherein the thermally color-developing compound (B) is a hydroxy-group-containing compound having a triarylmethane backbone. 
     
     
         7 . The resin composition according to  claim 4 , additionally containing (E) a dye and/or a pigment. 
     
     
         8 . The resin composition according to  claim 4 , additionally containing (F) a compound having 3 to 6 thermally crosslinkable groups per molecule. 
     
     
         9 . A resin composition having positive-working photosensitivity and comprising (A) an alkali-soluble resin, (I) a compound whose maximum absorption wavelength shifts by a heat treatment, (C) a photo-acid generator, and (D) a solvent. 
     
     
         10 . The resin composition having positive-working photosensitivity according to  claim 9 , wherein the alkali-soluble resin (A) is a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor. 
     
     
         11 . The resin composition having positive-working photosensitivity according to  claim 9 , wherein the alkali-soluble resin (A) comprises at least one alkali-soluble resin selected from: a resin having such a backbone structure that two cyclic structures are bonded to a cyclic-structure-constituting quaternary carbon atom; and a phenolic resin and/or a polyhydroxystyrene resin. 
     
     
         12 . The resin composition having positive-working photosensitivity according to  claim 9 , wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment has a maximum absorption wavelength of 340 nm or more and less than 450 nm after a heat treatment. 
     
     
         13 . The resin composition having positive-working photosensitivity according to  claim 9 , wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment is a compound which has one or more phenolic hydroxyl groups and in which one, several or all of the phenolic hydroxyl groups are respectively protected by protecting groups. 
     
     
         14 . The resin composition having positive-working photosensitivity according to  claim 13 , wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment has one or more phenolic hydroxyl groups and each of the protecting groups which respectively protect one, several or all of the phenolic hydroxyl groups is a heat-labile group or an acid-labile group. 
     
     
         15 . The resin composition having positive-working photosensitivity according to  claim 14 , wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment has one or more phenolic hydroxyl groups and a heat-labile group or an acid-labile group which protects each of one, several or all of the phenolic hydroxyl groups is represented by any one of general formula (8) to (11): 
       
         
           
           
               
               
           
         
       
       (in general formula (8), R 59  to R 61  may be the same as one another or one or some of R 59  to R 61  may be different from the others, and independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 or more carbon atoms; in general formula (9), n represents 0 or 1; in general formula (10), R 62  represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; and in general formula (11), Z represents a hydrogen atom, a sulfur atom or —N(R 63 )—R 64 , represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, and R 63  represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms). 
     
     
         16 . The resin composition having positive-working photosensitivity according to  claim 9 , wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment is a non-condensed polycyclic compound or a condensed polycyclic compound. 
     
     
         17 . The resin composition having positive-working photosensitivity according to  claim 9 , wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment is a non-condensed polycyclic compound or a condensed polycyclic compound each having 2 to 8 inclusive of aromatic rings. 
     
     
         18 . The resin composition having positive-working photosensitivity according to  claim 9 , additionally containing (J) a compound which does not have an absorption maximum at a wavelength of 340 nm or more and less than 436 nm and has an absorption maximum at a wavelength of 436 to 750 nm inclusive. 
     
     
         19 . The resin composition having positive-working photosensitivity according to  claim 9 , additionally containing (F) a compound having 3 to 6 thermally crosslinkable groups per molecule. 
     
     
         20 . A method for producing a heat-resistant resin film, comprising the steps of: applying a resin composition as recited in  claim 1  onto a substrate to form a coating film; drying the coating film; exposing the dried photosensitive resin film to light; developing the light-exposed photosensitive resin film; and subjecting the developed photosensitive resin film to a heat treatment. 
     
     
         21 . A method for producing a heat-resistant resin film, comprising the steps of: applying a resin composition as recited in  claim 1  onto a substrate using a slit nozzle to form a coating film; and drying the coating film under reduced pressure to form a photosensitive resin film. 
     
     
         22 . A display device comprising a substrate, a first electrode which is formed on the substrate, an insulating layer which is formed on the first electrode in such a manner as to allow the first electrode to be partially exposed to light, and a second electrode which is provided opposed to the first electrode, wherein the insulating layer is a heat-resistant resin film produced by a production method as recited in  claim 20 . 
     
     
         23 . A display device comprising a substrate on which thin film transistors (TFTs) are formed, a planarization film which is provided in such a manner as to cover projections and depressions on the substrate, and display elements which are provided on the planarization film, wherein the planarization film is a heat-resistant resin film produced by a production method as recited in  claim 20 . 
     
     
         24 . A display device comprising a substrate on which oxide TFTs are formed as thin film transistors (TFTs), a planarization film which is provided in such a manner as to cover projections and depressions on the substrate, and display elements which are provided on the planarization film, wherein the planarization film is a heat-resistant resin film produced by a production method as recited in  claim 20 . 
     
     
         25 . The display device according to  claim 23 , wherein the degree of resolution of each of the display elements is 200 ppi or more.