Battery thermal management system

Abstract

In certain embodiments, a battery thermal management system includes at least one battery, at least one thermoelectric device in thermal communication with the at least one battery, and a conduit comprising an inlet configured to allow a working fluid to enter and flow into the conduit and into thermal communication with the at least one thermoelectric device. The conduit further comprises an outlet configured to allow the working fluid to exit and flow from the conduit and away from being in thermal communication with the at least one thermoelectric device. The battery thermal management system can further include a first flow control device which directs the working fluid through the inlet of the conduit and a second flow control device which directs the working fluid through the outlet of the conduit. The first flow control device and the second flow control device are each separately operable from one another.

1 - 28 . (canceled) 
     
     
         29 . A device thermal management system comprising:
 a fluid loop configured to allow a liquid working fluid to flow in the fluid loop;   a plurality of thermoelectric assemblies configured to be in thermal communication with a device, wherein a first thermoelectric assembly of the plurality of thermoelectric assemblies is in electrical communication with a second thermoelectric assembly of the plurality of thermoelectric assemblies; and   a circuit in electrical communication with the first thermoelectric assembly and the second thermoelectric assembly, the circuit capable of selectively switching to place the first thermoelectric assembly and the second thermoelectric assembly either in series electrical communication or parallel electrical communication with one another to thermally manage,   wherein the plurality of thermoelectric assemblies are configured to thermally manage the device by transferring heat between the liquid working fluid and the device.   
     
     
         30 . The device thermal management system of  claim 29 , wherein the plurality of thermoelectric assemblies are configured to be selectively operable to either heat or cool the device. 
     
     
         31 . The device thermal management system of  claim 29 , wherein the circuit is capable of selectively switching to adjust current flow through the first thermoelectric assembly and the second thermoelectric assembly. 
     
     
         32 . The device thermal management system of  claim 29 , further comprising a monitor configured to monitor a parameter of the device, wherein the circuit is configured to be selectively switchable in response to the parameter. 
     
     
         33 . The device thermal management system of  claim 32 , wherein the monitor is on a surface of the device, the monitor configured to measure at least a temperature of the device. 
     
     
         34 . The device thermal management system of  claim 29 , wherein the circuit is capable of selectively switching in response to at least one of a temperature difference between a conditioning side or a heat rejection side and a fluid control device temperature. 
     
     
         35 . The device thermal management system of  claim 29 , wherein the circuit is capable of selectively switching in response to at least one of a voltage of the device or an electrical current of the device. 
     
     
         36 . The device thermal management system of  claim 29 , wherein the circuit is capable of selectively switching in response to a dimensional change of the device. 
     
     
         37 . The device thermal management system of  claim 29 , wherein the circuit is capable of selectively switching in response to at least one of a fluid flow rate of an other working fluid or a fluid velocity of the other working fluid, wherein the other working fluid flows into thermal communication with the device. 
     
     
         38 . The device thermal management system of  claim 29 , wherein the circuit is capable of selectively switching in response to at least one of a fluid control device speed, a fluid control device voltage, and a fluid control device electrical current. 
     
     
         39 . The device thermal management system of  claim 29 , wherein the circuit is capable of selectively switching in response to a temperature of the liquid working fluid. 
     
     
         40 . The device thermal management system of  claim 29 , further comprising:
 a first meter configured to measure a first electrical voltage or current of the first thermoelectric assembly;   a second meter configured to measure a second electric voltage or current of the second thermoelectric assembly or both the first and second thermoelectric assemblies; and   at least one monitor configured to monitor an electrical comparison parameter dependent on the first electrical voltage or current and the second electrical voltage or current,   wherein the circuit is capable of changing electrical power supplied to the plurality of thermoelectric assemblies in response to the electrical comparison parameter.   
     
     
         41 . The device thermal management system of  claim 40 , wherein the electrical comparison parameter comprises a value of the first electrical voltage or current divided by the second electrical voltage or current. 
     
     
         42 . A device thermal management system comprising:
 a plurality of thermoelectric assemblies configured to be in thermal communication with a device, wherein a first thermoelectric assembly of the plurality of thermoelectric assemblies is in electrical communication with a second thermoelectric assembly of the plurality of thermoelectric assemblies; and   a circuit in electrical communication with the first thermoelectric assembly and the second thermoelectric assembly, the circuit capable of selectively switching to place the first thermoelectric assembly and the second thermoelectric assembly either in series electrical communication or parallel electrical communication with one another to thermally manage the device.   
     
     
         43 . The device thermal management system of  claim 42 , further comprising a monitor configured to monitor a parameter of the device, wherein the circuit is configured to be selectively switchable in response to the parameter. 
     
     
         44 . The device thermal management system of  claim 43 , wherein the monitor is on a surface of the device, the monitor configured to measure at least a temperature of the device. 
     
     
         45 . The device thermal management system of  claim 42 , wherein the circuit is capable of selectively switching in response to at least one of a temperature difference between a conditioning side and a fluid control device temperature or a heat rejection side and an other fluid control device temperature. 
     
     
         46 . The device thermal management system of  claim 42 , wherein the circuit is configured to be selectively switchable in response to at least one of a working fluid inlet temperature, a working fluid outlet temperature, or a temperature differential between fluid inlet and outlet. 
     
     
         47 . The device thermal management system of  claim 42 , further comprising a fluid conduit configured to allow a working fluid to flow through fluid conduit, wherein the plurality of thermoelectric assemblies are configured to thermally manage the device by transferring heat between the working fluid and the device. 
     
     
         48 . The device thermal management system of  claim 47 , wherein a fluid loop comprises the fluid conduit. 
     
     
         49 . The device thermal management system of  claim 48 , wherein the working fluid comprises a liquid working fluid that flows in the fluid loop.