US2017294501A1PendingUtilityA1

Organic light-emitting diode display device and method of manufacturing the same

Assignee: SAMSUNG DISPLAY CO LTDPriority: Apr 12, 2016Filed: Nov 21, 2016Published: Oct 12, 2017
Est. expiryApr 12, 2036(~9.7 yrs left)· nominal 20-yr term from priority
H10K 71/00H10K 50/81H10K 50/84H01L 2251/5338H01L 51/56H01L 27/3246H01L 27/3276H01L 51/5246H01L 2251/301H01L 51/0097H01L 2227/323H10K 59/131H10K 59/1315Y02P70/50H10K 77/111H10K 59/123H10K 59/122H10K 2102/311H04R 1/2819H04R 1/2811H04R 1/288H04R 1/345H04R 1/2834H10K 59/1201H10K 50/8426H10K 2102/00Y02E10/549
35
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An organic light emitting device includes: a substrate; a first electrode provided on the substrate; a metal pattern provided along an edge of the first electrode; and a pixel definer provided on the metal pattern. The pixel definer covers an end portion of the first electrode and an end portion of the metal pattern. The pixel definer includes an opening exposing the first electrode.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An organic light-emitting display device comprising:
 a substrate;   a first electrode provided on the substrate;   a metal pattern provided along an edge of the first electrode; and   a pixel definer provided on the metal pattern,   wherein the pixel definer covers an end portion of the first electrode and an end portion of the metal pattern, and   wherein the pixel definer includes an opening exposing the first electrode.   
     
     
         2 . The organic light-emitting display device of  claim 1 , wherein the metal pattern has a thickness substantially equal to or greater than about 100 Å and substantially equal to or less than about 10,000 Å. 
     
     
         3 . The organic light-emitting display device of  claim 1 , wherein the metal pattern has an etching selection ratio that is different from an etching selection ratio of the first electrode. 
     
     
         4 . The organic light-emitting display device of  claim 3 , wherein the metal pattern includes copper (Cu) or a copper (Cu) alloy. 
     
     
         5 . The organic light-emitting display device of  claim 4 , wherein the copper (Cu) alloy includes titanium copper (TiCu) or molybdenum copper (MoCu). 
     
     
         6 . The organic light-emitting display device of  claim 3 , wherein the metal pattern includes a stacked configuration of a plurality of layers. 
     
     
         7 . The organic light-emitting display device of  claim 6 , wherein the stacked configuration is a configuration of a titanium (Ti) layer/aluminum (Al) layer or a titanium (Ti) layer/aluminum (Al) layer/titanium (Ti) layer. 
     
     
         8 . The organic light-emitting display device of  claim 1 , wherein an upper surface of the pixel definer has a curved shape. 
     
     
         9 . The organic light-emitting display device of  claim 1 , wherein
 the organic light-emitting display device includes a display area including a plurality of pixels and a peripheral area surrounding the display area;   the first electrode, the metal pattern, and the pixel definer are provided in the display area; and   the organic light-emitting display device further includes a dam portion provided in the peripheral area and provided along an edge of the substrate.   
     
     
         10 . The organic light-emitting display device of  claim 9 , wherein
 the dam portion includes:   a first layer including a same material as the first electrode;   a second layer including a same material as the metal pattern; and   a third layer including a same material as the pixel definer.   
     
     
         11 . The organic light-emitting display device of  claim 10 , wherein the organic light-emitting display device is a flexible display device. 
     
     
         12 . A method of manufacturing an organic light-emitting display device, the method comprising:
 disposing a first electrode material layer, a metal layer, and a pixel definer material layer on a substrate;   disposing a first electrode by patterning the first electrode material layer;   removing the pixel definer material layer remaining on the first electrode to expose the metal layer;   removing the metal layer exposed by the pixel definer material layer to generate a metal pattern provided along an edge of the first electrode; and   disposing a pixel definer by heat treating the pixel definer material layer remaining on the first electrode and the metal pattern.   
     
     
         13 . The method of  claim 12 , wherein
 the removing of the pixel definer material layer includes dry etching the pixel definer material layer, and   wherein the removing of the metal layer includes wet etching the metal layer.   
     
     
         14 . The method of  claim 13 , wherein
 the disposing of the first electrode includes:   patterning the first electrode material layer using a halftone mask, the halftone mask including a first region, a second region, and a third region;   retaining the pixel definer material layer corresponding to the first region, removing a part of the pixel definer material layer corresponding to the second region in a thickness direction, and removing substantially the entire pixel definer material layer corresponding to the third region; and   removing the metal layer and the first electrode material layer corresponding to the third region.   
     
     
         15 . The method of  claim 14 , wherein the metal layer has an etching selection ratio that is different from an etching selection ratio of the first electrode material layer. 
     
     
         16 . The method of  claim 15 , wherein the removing of the metal layer and the first electrode material layer corresponding to the third region includes removing the first electrode material layer prior to removing the metal layer. 
     
     
         17 . The method of  claim 12 , wherein
 a part of the pixel definer material layer is melted by the heat treatment to generate a pixel definer, and   wherein the pixel definer covers an end portion of the metal pattern and an end portion of the first electrode.   
     
     
         18 . The method of  claim 17 , wherein the heat treatment is performed at a temperature that is substantially equal to or greater than about 200° C. and less than about 400° C. 
     
     
         19 . The method of  claim 13 , wherein the disposing of the first electrode further includes disposing a dam portion along an edge of the substrate. 
     
     
         20 . The method of  claim 19 , wherein
 the halftone mask includes a fourth region having substantially the same transmittance as the first region, and   wherein the dam portion corresponds to the fourth region.

Join the waitlist — get patent alerts

Track US2017294501A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.