Handheld electronic device

Abstract

The invention provides a handheld electronic device including a case, a touch display module, a pressure sensing layer, and a metal layer. The case has a receiving recess. The touch display module is disposed in the receiving recess and includes an embedded touch display panel and a backlight module located under the embedded touch display panel. The pressure sensing layer is built in the touch display module. The metal layer is disposed in the receiving recess and located under the backlight module. An air gap exists between the metal layer and the backlight module. The pressure sensing layer, the air gap, and the metal layer constitute a capacitor unit. According to the invention, the production costs of the handheld electronic device are reduced and the processes of fabrication are simplified.

What is claimed is: 
     
         1 . A handheld electronic device, comprising:
 a case having a receiving recess;   a touch display module disposed in the receiving recess of the case and comprising an embedded touch display panel and a backlight module located under the embedded touch display panel;   a pressure sensing layer built in the touch display module; and   a metal layer disposed in the receiving recess of the case and located under the backlight module, wherein an air gap exists between the metal layer and the backlight module, and the pressure sensing layer, the air gap, and the metal layer constitute a capacitor unit.   
     
     
         2 . The handheld electronic device as recited in  claim 1 , wherein the embedded touch display panel comprises a plurality of common electrode patterns that are separated from one another and have touch and pressure sensing functions, wherein the common electrode patterns define the pressure sensing layer. 
     
     
         3 . The handheld electronic device as recited in  claim 2 , wherein a shape of the common electrode patterns is square or rectangular. 
     
     
         4 . The handheld electronic device as recited in  claim 2 , wherein the embedded touch display panel is a self-capacitive touch display panel or a mutual-capacitive touch display panel. 
     
     
         5 . The handheld electronic device as recited in  claim 1 , wherein the pressure sensing layer is built in a peripheral region of an active device array substrate of the embedded touch display panel. 
     
     
         6 . The handheld electronic device as recited in  claim 5 , wherein the pressure sensing layer comprises a plurality of pressure sensing pads that are located at corners of the active device array substrate respectively. 
     
     
         7 . The handheld electronic device as recited in  claim 5 , wherein the pressure sensing layer comprises at least one first pressure sensing pad located on a first side of the active device array substrate and a plurality of second sensing pads located on a second side of the active device array substrate, and the first side and the second side are opposite to each other, wherein a surface area of the first pressure sensing pad is larger than a surface area of one of the second pressure sensing pads. 
     
     
         8 . The handheld electronic device as recited in  claim 1 , wherein the embedded touch display panel at least comprises the active device array substrate, an active device layer, a display medium layer, and an opposite substrate that are stacked sequentially, wherein the pressure sensing layer comprises a sensing layer and a planar layer, and the sensing layer is located between the active device array substrate and the active device layer while the planar layer is located between the sensing layer and the active device layer. 
     
     
         9 . The handheld electronic device as recited in  claim 1 , wherein the pressure sensing layer is disposed under the active device array substrate of the embedded touch display panel and located between the active device array substrate and the backlight module. 
     
     
         10 . The handheld electronic device as recited in  claim 1 , further comprising:
 a system circuit board disposed in the receiving recess of the case and located between the metal layer and the case;   a power supply disposed in the receiving recess of the case and located between the metal layer and the case; and   a covering layer disposed on the case and covering the touch display module.