Method for structuring food for microwave

Abstract

Methods are generally described herein for structuring food for microwave heating. In some examples, food with high dielectric loss factor is dispersed in a matrix of foods with low dielectric loss factors to promote uniform heating and efficient heating. In other examples, microwave susceptors are sandwiched between layers of food and attached to a handle whereby said microwave susceptors can be removed by pulling on the handle after microwave heating.

What is claimed is: 
     
         1 . A method for packaging foods for microwave heating, the method comprising placing thin layers of a first material having high dielectric loss factor between layers of a second material having low dielectric loss factors. 
     
     
         2 . The method of  claim 1  wherein the first material is microwave susceptor containing holes. 
     
     
         3 . The method of  claim 2  wherein the microwave susceptor layers are attached to a handle. 
     
     
         4 . The method of  claim 1  wherein the first material is a food. 
     
     
         5 . The method of  claim 4  wherein the first material contains holes. 
     
     
         6 . The method of  claim 4  wherein first material comprises one or more of the following: cheese, ketchup, mustard, salsa, salted meat, butter, cooking oil. 
     
     
         7 . The method of  claim 1  wherein the second material comprises eggs. 
     
     
         8 . The method of  claim 1 , wherein the packaged foods are placed in a container, the container further comprising a metalized film as a microwave susceptor on at least one side of the container. 
     
     
         9 . A Method for packaging food for microwave processing, the method comprising dispersing a first food having high dielectric loss factor in a matrix of a second food having low dielectric loss factor. 
     
     
         10 . The method for packaging food for microwave processing of  claim 9 , wherein the first food is in granulated form. 
     
     
         11 . The method for packaging food for microwave processing of  claim 10 , wherein the first food comprises one or more of the following: ham, cheese, sausage, salted vegetables. 
     
     
         12 . The method for packaging food for microwave processing of  claim 9 , wherein the second food comprises one or more of the following: egg, rice, dough, unsalted vegetables. 
     
     
         13 . A method for packaging food for microwave processing, the method comprising placing a liquid food having low dielectric loss factors in pockets, said pocket comprising thin layer of a second food having high dielectric loss factors. 
     
     
         14 . The method of  claim 13  wherein the second food comprises one or more of the following ingredients: cheese, ham, salted vegetables. 
     
     
         15 . The method of  claim 13  wherein said liquid food comprises eggs.