Grinding ring set for semiconductor wafer in chemical and mechanical grinding process

Abstract

A grinding ring set for semiconductor wafer in chemical and mechanical grinding process includes a grinding surface and an attaching surface attaching to the grinding surface. Material of the attaching ring is selected from HDPE, PE, PPS, PBT, PEI, PEEK, PET, PTFE, PBI, PAI, PETP, PVC, NYLON, POM, ABS, PVDF, etc. or the combination thereof, compound of two or more plastic additives, which has a weight percentage between 0.9-1.8 g/cm3. The grinding ring set may also be made of plastic materials, but is different from those used in the attaching ring. Therefore, by above mentioned design, the whole weight is light with a preferred strength, lower cost, less processes, and reduction of rust, etc. Furthermore, plastic is more flexible then metal.

What is claimed is: 
     
         1 . A grinding ring set for semiconductor wafer in chemical and mechanical grinding process; the grinding ring set comprising:
 a grinding surface;   an attaching surface attaching to the grinding surface; and   wherein material of the attaching ring is selected from High-density polyethylene (HDPE), Polyethylene (PE), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), carbin-filled PEEK, polyetherimide (PEI), polyether ether ketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polybenzimidazole (PBI), polyamide-imide (PAI), PETP, PVC, NYLON, POM, ABS, PTFE, PVDF, or the combination thereof, or compound of two or more plastic additives, which has a weight percentage between 0.9-1.8 g/cm3.   
     
     
         2 . The grinding ring set for semiconductor wafer in chemical and mechanical grinding process as claimed in  claim 1 , wherein the grinding ring set is made of plastic materials, but is different from those used in the attaching ring. 
     
     
         3 . The grinding ring set for semiconductor wafer in chemical and mechanical grinding process as claimed in  claim 1 , wherein the attaching ring is formed with a plurality of through holes; the grinding surface is formed with a plurality of recesses corresponding to the through holes; each recess has a long hole and an enlarged hole; a plurality of combining studs are used to combine the attaching ring to the grinding ring set; each stud has a body; a rear end of the body has an enlarged hat; an interior width of the enlarged hole is larger than an outer diameter of the hat so as to receive the hat therein; a width of the long hole is smaller than that of the outer diameter of the hat; by the studs pass through the through holes to the recesses, the hat will resist against a lower side of the long hole. 
     
     
         4 . The grinding ring set for semiconductor wafer in chemical and mechanical grinding process as claimed in  claim 3 , wherein the body of the stud is screwed to the through hole of the attaching ring.