Substrate processing apparatus and substrate processing method
Abstract
A substrate processing apparatus comprises: a first chamber; a liquid film former which forms a liquid film P of a solution containing a sublimable substance having sublimability on a surface of a substrate in the first chamber; a second chamber 30 which receives the substrate W having the liquid film; a plate unit 311 provided in the second chamber such that the substrate W is placeable on an upper surface thereof; a temperature controller 312, 335 which controls a temperature of the upper surface of the plate unit 311 to a predetermined temperature; and a heater 322 which heats and sublimates the sublimable substance precipitated from the solution on the substrate W placed on the plate unit 311.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A substrate processing apparatus, comprising:
a first chamber; a liquid film former which forms a liquid film of a solution containing a sublimable substance having sublimability on a surface of a substrate in the first chamber; a second chamber which receives the substrate having the liquid film formed thereon; a plate unit which is provided in the second chamber such that the substrate is placeable on an upper surface thereof; a temperature controller which controls a temperature of the upper surface of the plate unit to a predetermined temperature; and a heater which heats and sublimates the sublimable substance precipitated from the solution on the substrate placed on the plate unit.
2 . The substrate processing apparatus according to claim 1 , wherein
the heater irradiates an electromagnetic wave for increasing the temperature of the sublimable substance toward the plate unit from above the plate unit.
3 . The substrate processing apparatus according to claim 1 , wherein the heater includes:
a heat radiating member which is controlled to have a temperature higher than the plate unit; and a moving mechanism which moves the heat radiating member between a proximate position where the heat radiating member is proximately facing the upper surface of the plate unit and a separated position where the heat radiating member is more distant from the plate unit than at the proximate position.
4 . The substrate processing apparatus according to claim 1 , further comprising an ejector which ejects the sublimated sublimable substance from an atmosphere of the substrate surface.
5 . The substrate processing apparatus according to claim 1 , further comprising a rotator which rotates the plate unit about a vertical axis.
6 . The substrate processing apparatus according to claim 1 , further comprising a conveyor which conveys the substrate having the liquid film formed thereon from the first chamber to the second chamber.
7 . The substrate processing apparatus according to claim 1 , wherein the liquid film former includes:
a holder which holds the substrate in a horizontal posture in the first chamber; and a liquid supplier supplies a solution to the upper surface of the substrate to form the liquid film.
8 . A substrate processing apparatus, comprising:
a chamber which receives a substrate having a liquid film of a solution containing a sublimable substance having sublimability formed on a surface thereof; a plate unit which is provided in the chamber such that the substrate is placeable on an upper surface thereof; a temperature controller which controls a temperature of the upper surface of the plate unit to a predetermined temperature; and a heater which heats and sublimates the sublimable substance precipitated from the solution on the substrate placed on the plate unit.
9 . The substrate processing apparatus according to claim 8 , wherein
the heater irradiates an electromagnetic wave for increasing the temperature of the sublimable substance toward the plate unit from above the plate unit.
10 . The substrate processing apparatus according to claim 8 , wherein the heater includes:
a heat radiating member which is controlled to have a temperature higher than the plate unit; and a moving mechanism which moves the heat radiating member between a proximate position where the heat radiating member is proximately facing the upper surface of the plate unit and a separated position where the heat radiating member is more distant from the plate unit than at the proximate position.
11 . The substrate processing apparatus according to claim 8 , further comprising an ejector which ejects the sublimated sublimable substance from an atmosphere of the substrate surface.
12 . The substrate processing apparatus according to claim 8 , further comprising a rotator which rotates the plate unit about a vertical axis.
13 . A substrate processing method, comprising:
forming a liquid film by a solution containing a sublimable substance having sublimability on a surface of a substrate in a first chamber; conveying the substrate having the liquid film to a second chamber and placing the substrate on a plate unit which is provided in the second chamber and has an upper surface temperature-controlled to a predetermined temperature; evaporating a solvent from the liquid film on the substrate placed on the plate unit and precipitating the sublimable substance in the second chamber; and heating and sublimating the sublimable substance precipitated in the second chamber.Join the waitlist — get patent alerts
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