Attachment for an electronic communications device

Abstract

An attachment for an electronic communications device including a conducting element that is coated on one side with layers of material and securely affixed to a nonconducting substrate such that the overall dimensions and thickness of the attachment are sufficiently small that it may be attached to a surface of an electronic communications device whilst allowing the use of any protective casing preferred by the user.

What is claimed is: 
     
         1 . A case for an electronic communications device comprising:
 a protective shell of a base material having a rear panel and edges adapted to grip outer surfaces of the communications device; and   an attachment comprising a conducting element that is coated on one side with layers of dielectric material and securely affixed to a non-conducting substrate such that the overall dimensions and thickness of the attachment are sufficiently small to allow the attachment to be attached to an outer surface of the electronic communications device, or embedded within or attached to the protective shell of the case, whilst not requiring any modification of the case in order to avoid interfering with the use of the case.   
     
     
         2 . The case according to  claim 1  wherein the non-conducting substrate comprises PTFE (polytetrafluoroethylene) that is about 0.2 mm in thickness. 
     
     
         3 . The case according to  claim 1  wherein the conducting element comprises conductive material that is copper having a thickness of about 0.1 mm. 
     
     
         4 . The case according to  claim 1  wherein the conducting element includes various shaped segments of conducting material and includes V-shaped segments, chevron-shaped segments, linear segments, rectangular and/or triangular segments or any segments or combinations thereof. 
     
     
         5 . The case according to  claim 1  wherein the layers of material that coat the conducting element comprise dielectric materials that are mixed and sprayed in layers onto the conducting element. 
     
     
         6 . The case according to  claim 1  wherein the conducting element is coated on both sides with layers of dielectric materials. 
     
     
         7 . The case according to  claim 1  wherein the dielectric material includes any one or more of Al203, SiO2, Ag2O, B203, Mg0, Fe203, Na20, K20, Ca0, P205, Au, TiO2 and/or Fe0. 
     
     
         8 . The case according to  claim 5  wherein the conducting element, once coated with dielectric materials, is subsequently coated with UV acrylic material.