Heat pipe module and heat dissipating device using the same

Abstract

A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

What is claimed is: 
     
         1 . A heat pipe module, comprising:
 at least a first pipe body, wherein an inner wall of the first pipe body defines a hollow chamber; and   at least a second pipe body, wherein a part of the second pipe body is disposed in the hollow chamber, and an external wall of the part of the second pipe body directly contacts the first pipe body.   
     
     
         2 . The heat pipe module of  claim 1 , wherein the external wall of the second pipe body directly contacts the inner wall of the first pipe body. 
     
     
         3 . The heat pipe module of  claim 1 , wherein a surface area of the inner wall of the first pipe body is larger than a surface area of the external wall of the second pipe body. 
     
     
         4 . The heat pipe module of  claim 1 , further comprising:
 a capillary structure disposed on the inner wall of the first pipe body.   
     
     
         5 . The heat pipe module of  claim 4 , wherein the external wall of the second pipe body directly contacts the capillary structure. 
     
     
         6 . The heat pipe module of  claim 4 , wherein the capillary structure is only configured at contact portions of the first pipe body and the second pipe body. 
     
     
         7 . The heat pipe module of  claim 4 , further comprising:
 a vaporization portion and a condensation portion, wherein the second pipe body is located at a part of the vaporization portion and all of the condensation portion.   
     
     
         8 . The heat pipe module of  claim 7 , wherein the capillary structure is disposed on an end of the inner wall of the first pipe body closing to the condensation portion. 
     
     
         9 . The heat pipe module of  claim 4 , wherein the first pipe body has a supporting structure disposed between the capillary structure and the second pipe body. 
     
     
         10 . The heat pipe module of  claim 1 , further comprising:
 a plurality of second pipe body disposed in the first pipe body and arranged side by side.   
     
     
         11 . The heat pipe module of  claim 1 , wherein the first pipe body is a heat pipe or a vapor chamber. 
     
     
         12 . The heat pipe module of  claim 1 , wherein the second pipe body is a heat pipe, a vapor chamber or a metal pipe. 
     
     
         13 . A heat dissipating device, comprising:
 a heat pipe module comprising at least a first pipe body and at least a second pipe body, wherein an inner wall of the first pipe body defines a hollow chamber, a part of the second pipe body is disposed in the hollow chamber, and an external wall of the part of the second pipe body directly contacts the first pipe body; and   a heat sink having a plurality fins disposed on the second pipe body.   
     
     
         14 . The heat dissipating device of  claim 13 , wherein the external wall of the second pipe body directly contacts the inner wall of the first pipe body. 
     
     
         15 . The heat dissipating device of  claim 13 , wherein a surface area of the inner wall of the first pipe body is larger than a surface area of the external wall of the second pipe body. 
     
     
         16 . The heat dissipating device of  claim 13 , wherein the heat pipe module further comprises:
 a capillary structure disposed on the inner wall of the first pipe body.   
     
     
         17 . The heat dissipating device of  claim 16 , wherein the external wall of the second pipe body directly contacts the capillary structure. 
     
     
         18 . The heat dissipating device of  claim 16 , wherein the capillary structure is only configured at contact portions of the first pipe body and the second pipe body. 
     
     
         19 . The heat dissipating device of  claim 16 , wherein the heat pipe module further comprises:
 a vaporization portion and a condensation portion, wherein the second pipe body is located at a part of the vaporization portion and all of the condensation portion, and the capillary structure is disposed on an end of the inner wall of the first pipe body closing to the condensation portion.   
     
     
         20 . The heat dissipating device of  claim 16 , wherein the first pipe body has a supporting structure disposed between the capillary structure and the second pipe body, and the heat pipe module further comprises a plurality of second pipe body disposed in the first pipe body and arranged side by side.