Additive-Based Process for Producing Micro-Channel Devices

Abstract

A micro-channel device is formed from a rigid template of a suitable material, such as wax, by forming a continuous electrically-conductive structure over the rigid template to thereby define channels. The rigid template is then removed, thereby forming the micro-channel device. Examples of micro-channel devices include micro-channel thermal management units and micro-channel chemical reactors. Micro-channel chemical reactors can be formed by coating interior walls of the micro-channel device with a suitable catalyst.

What is claimed is: 
     
         1 . A method for forming a micro-channel device, comprising the steps of:
 a) forming a rigid template representing channels of a micro-channel thermal management unit, at least a portion of the channels having a cross-sectional diameter in a range of between about 20 and about 6,350 micrometers;   b) forming a continuous electrically-conductive structure over the rigid template, wherein the electrically-conductive structure defines the channels represented by the rigid template; and   c) removing the rigid template from the electrically-conductive structure, thereby forming the micro-channel device.   
     
     
         2 . The method of  claim 1 , wherein the electrically-conductive structure defines an inlet and an outlet, and a conduit between the inlet and the outlet, whereby a fluid can be directed through the electrically-conductive structure from the inlet to the outlet to thereby transfer heat from the electrically-conductive structure. 
     
     
         3 . The method of  claim 2 , wherein the rigid template includes at least one material selected from the group consisting of wax, plastic or metal. 
     
     
         4 . The method of  claim 3 , wherein the rigid template is formed by casting, extrusion, stamping individually or collectively. 
     
     
         5 . The method of  claim 4 , wherein the rigid template is removed by at least one of heating, melting, burning, and dissolution of the rigid template within the electrically-conductive structure. 
     
     
         6 . The method of  claim 4 , electrically-conductive structure is formed by electroplating a metal over the rigid template. 
     
     
         7 . The method of  claim 6 , further including the step of making a surface of the rigid template electrically conductive by coating the surface with at least one member of the group consisting of copper, silver, nickel and carbon prior to electroplating. 
     
     
         8 . The method of  claim 7 , wherein the metal electroplated over the rigid template is at least one member selected from the group consisting of copper, aluminum, zinc, nickel, gold and precious metals. 
     
     
         9 . The method of  claim 1 , further including the step of coating the internal walls of the device with a catalyst. 
     
     
         10 . The method of  claim 9 , wherein the catalyst includes at least one member of the group consisting of platinum, ruthenium, palladium, gold, nickel and iridium.