Polishing pad

Abstract

A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad ( 10 ) includes a structure ( 40, 50 ) including a polishing surface ( 30 ) formed of a hard resin layer ( 40 ), the structure ( 40, 50 ) allowing the polishing surface ( 30 ) to follow a curved surface of a polishing target ( 90 ).

1 . A polishing pad comprising:
 a structure including a polishing surface formed of a hard resin layer, the structure allowing the polishing surface to follow a curved surface of a polishing target.   
     
     
         2 . The polishing pad according to  claim 1 , wherein the structure allowing the polishing surface to follow the curved surface of the polishing target is a two-layer structure including: a soft resin layer that supports the hard resin layer; and the hard resin layer. 
     
     
         3 . The polishing pad according to  claim 2 , wherein a groove is formed in the polishing surface. 
     
     
         4 . The polishing pad according to  claim 3 , wherein the groove divides the hard resin layer into a plurality of regions. 
     
     
         5 . The polishing pad according to  claim 4 , wherein the groove is also formed in the soft resin layer. 
     
     
         6 . The polishing pad according to  claim 1 , wherein a groove is formed in the polishing surface. 
     
     
         7 . The polishing pad according to  claim 6 , wherein the groove divides the hard resin layer into a plurality of regions.