US2017243103A1PendingUtilityA1

Board embedded with electronic device

Assignee: PALLETECHNOLOGY INCPriority: Sep 22, 2015Filed: May 11, 2017Published: Aug 24, 2017
Est. expirySep 22, 2035(~9.2 yrs left)· nominal 20-yr term from priority
G06K 19/07722G06K 19/07749H04B 1/38H04W 12/08Y02D30/70H04W 4/80H04W 52/0254H04W 76/11H04W 52/0241H04B 1/40
51
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The disclosed technology addresses the need in the art for a board embedded with an electronic device. In some embodiments, a board can be embedded with a Radio Frequency Emitting Device (RFED). The board can comprise at least a first layer and a second layer. The first layer can be made of a first paper based composite material and include at least a first enclosed cavity storing a RFED, wherein at least a portion of the first layer is coated with a moisture resistant material. The first layer can be affixed to the second layer that is made of a second material different than the first material, wherein at least a portion of the second layer is coated with the moisture resistant material.

Claims

exact text as granted — not AI-modified
1 . A board comprising:
 a first layer made of a first paper based composite material, the first layer comprising at least a portion of a first enclosed cavity storing a Radio Frequency Emitting Device (RFED), wherein at least a portion of the first layer is coated with a moisture resistant material; and   a second layer affixed to the first layer, the second layer made of a second material different than the first paper based composite, wherein at least a portion of the second layer is coated with the moisture resistant material.   
     
     
         2 . The board of  claim 1 , wherein the at least a portion of the first enclosed cavity is positioned at or substantially near a center of the first layer. 
     
     
         3 . The board of  claim 1 , wherein the first paper based composite material is a first density and the second material is a second density, wherein the second density is greater than the first density. 
     
     
         4 . The board of  claim 3 , wherein the board is detachably coupled to at least a first supporting leg of a supply chain asset, the board creating at least a portion of a shipping surface of the supply chain asset, wherein the second layer is positioned between the first layer and the first supporting leg of the supply chain asset. 
     
     
         5 . The board of  claim 4 , wherein at least a second board is detachably coupled to the first supporting leg and creating a second portion of the shipping surface of the supply chain asset. 
     
     
         6 . The board of  claim 5 , wherein the board is smaller than the second board. 
     
     
         7 . The board of  claim 6 , wherein the second board is also detachably coupled to a second supporting leg of the supply chain asset that the board is not coupled to. 
     
     
         8 . The board of  claim 4 , wherein the supply chain asset is a pallet. 
     
     
         9 . The board of  claim 4 , wherein the supply chain asset is a shipping crate. 
     
     
         10 . The board of  claim 4 , wherein the supply chain asset is one of a beer keg, plastic tote, returnable plastic containers (RPC), airline container, intermediate bulk container, liquid container, dry container, hazardous container or horticulture container. 
     
     
         11 . The board of  claim 1 , wherein the first layer further comprises a high impact resistant portion positioned over the first enclosed cavity. 
     
     
         12 . The board of  claim 1 , further comprising a third layer made of a high impact resistant material, the third layer affixed to the first layer, wherein the first layer is positioned between the third layer and the second layer. 
     
     
         13 . The board of  claim 1 , wherein the first layer further comprises at least a portion of a second enclosed cavity storing an electronic sensor. 
     
     
         14 . The board of  claim 13 , wherein the electronic sensor is configured to gather location data describing location of the electronic sensor. 
     
     
         15 . The board of  claim 13 , wherein the electronic sensor is configured to detect changes in motion. 
     
     
         16 . The board of  claim 13 , wherein the electronic sensor is configured to detect a physical weight of items placed on the board. 
     
     
         17 . The board of  claim 13 , wherein the first layer further comprises a high impact resistant portion positioned over the second enclosed cavity. 
     
     
         18 . The board of  claim 13 , wherein the second enclosed cavity is positioned at or substantially near a center of the first layer. 
     
     
         19 . The board of  claim 13 , wherein the second enclosed cavity is positioned substantially near an end of the first layer. 
     
     
         20 . The board of  claim 1 , wherein the second material is plastic.

Join the waitlist — get patent alerts

Track US2017243103A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.