Edge finishing apparatus and methods for laminate production

Abstract

Embodiments of a grinding wheel and methods for edge finishing glass substrates are disclosed. In one or more embodiments, the grinding wheel includes a metal matrix structure, a plurality of primary abrasive particles and a plurality of secondary abrasive particles bonded to the matrix structure, wherein one of the primary abrasive diamond particles and secondary abrasive particles comprises resin bond diamond particles. In some embodiments, the other of the primary abrasive diamond particles and secondary abrasive particles comprises metal bond diamond particles.

What is claimed is: 
     
         1 . A grinding wheel comprising:
 a metal matrix structure;   a plurality of primary abrasive diamond particles within the matrix structure and having a primary particle size; and   a plurality of secondary abrasive particles within the matrix structure and having a secondary particle size that is less than or equal to the primary particle size, wherein one of the primary abrasive diamond particles and secondary abrasive particles comprises resin bond diamond particles.   
     
     
         2 . The grinding wheel of  claim 1 , wherein the grinding wheel comprise a grinding wheel volume, wherein the metal bond matrix structure comprises from about 60 volume % to about 90 volume % of the grinding wheel volume, and wherein the plurality of primary abrasive diamond particles and the plurality of secondary abrasive particles comprises from about 10 volume % to about 40 volume % of the grinding wheel volume. 
     
     
         3 . The grinding wheel of  claim 1 , wherein the plurality of primary abrasive diamond particles comprises resin bond diamond particles and the plurality of secondary abrasive particles comprises metal bond diamond particles. 
     
     
         4 . The grinding wheel of  claim 1 , wherein the plurality of secondary abrasive particles comprises resin bond diamond particles and the plurality of primary abrasive diamond particles comprises metal bond diamond particles. 
     
     
         5 . The grinding wheel of  claim 1 , wherein the metal bond matrix structure comprises iron. 
     
     
         6 . The grinding wheel of  claim 1 , wherein the primary abrasive diamond particles and second abrasive particles comprise a total abrasive particle volume, wherein the primary abrasive particles comprise from about 51% to about 97% of the total abrasive particle volume, and wherein the secondary abrasive particles comprise from about 2% to about 48% of the total abrasive particle volume. 
     
     
         7 . The grinding wheel of  claim 6 , wherein the primary diamond abrasive particles comprise from about 60% to about 75% of the total abrasive particle volume, and wherein the secondary abrasive particles comprise from about 25% to about 35% of the total abrasive particle volume. 
     
     
         8 . The grinding wheel of  claim 1 , further comprising a plurality of tertiary diamond abrasive particles within the metal bond matrix structure, the plurality of tertiary diamond abrasive particles having a tertiary particle size less than or equal to the secondary particle size. 
     
     
         9 . The grinding wheel of  claim 1 , wherein the primary particle size is in a range from about 30 microns to about 40 microns and the secondary particle size in a range from about 20 microns to about 30 microns. 
     
     
         10 . The grinding wheel of  claim 8 , wherein the primary particle size is in a range from about 30 microns to about 40 microns, the secondary particle size in a range from about 20 microns to about 30 microns, and the tertiary particle size is in a range from about 1 micron to about 10 microns. 
     
     
         11 . The grinding wheel of  claim 1 , wherein the primary particle size is in a range from about 50 microns to about 60 micrometers and the secondary particle size in a range from about 40 microns to about 50 microns. 
     
     
         12 . The grinding wheel of  claim 8 , wherein the primary particle size is in a range from about 50 microns to about 60 microns, the secondary particle size in a range from about 40 microns to about 50 microns, and the tertiary particle size is in a range from about 4 microns to about 8 microns. 
     
     
         13 . The grinding wheel of  claim 1 , wherein the primary abrasive particles comprise resin bond diamond particles and the secondary abrasive particles comprise silicon carbide particles. 
     
     
         14 . The grinding wheel of  claim 13 , wherein the primary particle size is in a range from about 30 microns to about 40 microns and the secondary particle size in a range from about 15 microns to about 30 microns. 
     
     
         15 . The grinding wheel of  claim 14 , further comprising tertiary diamond abrasive particles within the metal bond matrix structure and having a tertiary particle size less than the secondary particle size. 
     
     
         16 . The grinding wheel of  claim 15 , wherein the tertiary particle size is in a range from about 1 to about 10 microns. 
     
     
         17 . The grinding wheel of  claim 1 , wherein the primary abrasive particles comprise cubo-octahedral morphology diamond particles and the secondary abrasive particles comprise particles having a morphology that is not cubo-octahedral. 
     
     
         18 . The grinding wheel of  claim 1 , wherein the secondary abrasive particles comprise cubo-octahedral morphology diamond particles and the primary abrasive particles comprise particles having a morphology that is not cubo-octahedral. 
     
     
         19 . The grinding wheel of  claim 1 , wherein the primary abrasive particles comprise metal bond diamond particles and the secondary abrasive particles comprise silicon carbide particles. 
     
     
         20 . The grinding wheel of  claim 8 , wherein the primary abrasive particles comprise metal bond diamond particles, the secondary abrasive particles comprise resin bond diamond particles or silicon carbide particles, and the tertiary abrasive particles comprise silicon carbide. 
     
     
         21 . A grinding wheel comprising:
 a metal bond matrix structure;   a plurality of primary abrasive diamond particles chemically bonded to or mechanically encapsulated within the metal bond matrix structure and having a primary particle size in a range of 30 microns to 100 microns; and   a plurality of secondary abrasive particles having a secondary particle size less than or equal to the primary particle size, wherein the secondary abrasive particles are chemically bonded to or mechanically encapsulated within the metal bond matrix structure,   wherein one of the primary abrasive diamond particles and secondary abrasive particles comprises resin bond diamond particles,   wherein the primary abrasive diamond particles and second abrasive particles comprise a total abrasive particle volume, and   wherein the primary abrasive diamond particles comprise from about 51% to about 97% of the total abrasive diamond particle volume and the secondary particles comprise from about 2% to about 48% of the total abrasive diamond particle volume.