Thermal transfer devices, temperature stabilized containers including the same, and related methods

Abstract

Generally, this disclosure relates to a temperature-stabilized and/or temperature-controlled storage container. In an embodiment, the storage container may include e a temperature-control regulator or assembly that may control the temperature in the interior space of the temperature-stabilized storage container.

What is claimed is: 
     
         1 . A thermal transfer device for a storage container, the thermal transfer device comprising:
 a housing including,
 a top plate; 
 a first pillar extending from the top plate; and 
 a second pillar extending from the top plate; 
   at least one phase change material (PCM) container containing at least one first PCM and being configured to be positioned in thermal communication with the first pillar of the housing;   at least one PCM carrier containing at least one second PCM and being configured to be positioned in thermal communication with one or more of the first pillar or the second pillar; and   a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar, or the second pillar.   
     
     
         2 . The thermal transfer device of  claim 1 , further including a base plate spaced from the top plate and from which the first and second pillars extend. 
     
     
         3 . The thermal transfer device of  claim 2 , wherein the base plate is attached to the first and second pillars and positioned generally opposite to the top plate. 
     
     
         4 . The thermal transfer device of  claim 1 , wherein the second pillar includes a first pillar portion and a second pillar portion connected together. 
     
     
         5 . The thermal transfer device of  claim 4 , wherein the heat pipe is positioned between and secured in thermal communication to the first and second pillar portions. 
     
     
         6 . The thermal transfer device of  claim 1 , wherein the heat pipe includes a second thermal end in thermal communication with one or more of a cooling unit or a heating unit. 
     
     
         7 . The thermal transfer device of  claim 6 , wherein the second thermal end of the heat pipe is in thermal communication with a thermoelectric cooler (TEC) configured to cool the second thermal end of the heat pipe. 
     
     
         8 . The thermal transfer device of  claim 7 , wherein the TEC includes a cold side in thermal communication with the second end of the heat pipe and a hot side in thermal communication with one or more secondary heat pipes at first thermal ends thereof. 
     
     
         9 . The thermal transfer device of  claim 7 , further including an electronic controller operably coupled to the TEC and configured to control operation of the TEC. 
     
     
         10 . The thermal transfer device of  claim 8 , wherein the one or more secondary heat pipes include second ends in thermal communication with one or more heat sinks. 
     
     
         11 . The thermal transfer device of  claim 10 , further including one or more fans positioned to produce fluid flow across the one or more heat sinks. 
     
     
         12 . The thermal transfer device of  claim 1 , wherein the at least one first PCM is substantial the same as the at least one second PCM. 
     
     
         13 . The thermal transfer device of  claim 1 , wherein the at least one first PCM is different from the at least one second PCM. 
     
     
         14 . The thermal transfer device of  claim 1 , wherein the at least one PCM container is fastenable to the first pillar. 
     
     
         15 . The thermal transfer device of  claim 14 , wherein the at least one PCM container includes one or more pivotable locks, the first pillar includes one or more cutouts sized and positioned to accept corresponding ones of the one or more pivotable locks in a manner that pivoting of the one or more pivotable locks fastens or unfastens the at least one PCM container relative to the first pillar. 
     
     
         16 . The thermal transfer device of  claim 1 , wherein the housing further includes a third pillar extending from the top plate and positioned substantially in a plane that is substantially parallel to the first and second pillars, the second pillar being positioned between the first pillar and the third panel. 
     
     
         17 . The thermal transfer device of  claim 16 , wherein the at least one first PCM includes first and second PCM portions, and wherein the at least one PCM container includes a first PCM container containing the first PCM portion in thermal communication with the first pillar and a second PCM container containing the second PCM portion in thermal communication with the third pillar. 
     
     
         18 . The thermal transfer device of  claim 17 , wherein the first PCM portion is the same as the second PCM portion. 
     
     
         19 . The thermal transfer device of  claim 17 , wherein the first PCM container is fastenable to the first pillar and the second PCM container is fastenable to the third pillar. 
     
     
         20 . The thermal transfer device of  claim 19 , wherein the second PCM container includes one or more pivotable locks, the third pillar includes one or more cutouts sized and positioned to accept the one or more pivotable locks in a manner that pivoting f corresponding ones of the one or more pivotable locks fastens or unfastens the second PCM container relative to the third panel. 
     
     
         21 . The thermal transfer device of  claim 1 , wherein the at least one PCM carrier is removably positioned in a space defined by the first and second pillars. 
     
     
         22 . The thermal transfer device of  claim 21 , wherein the at least one PCM carrier is magnetically securable to the housing. 
     
     
         23 . The thermal transfer device of  claim 1 , wherein the at least one PCM carrier includes a first PCM carrier compartment and a second PCM carrier compartment, and wherein the at least one second PCM includes two or more PCM containers positioned inside the first and second PCM carrier compartments, respectively. 
     
     
         24 . The thermal transfer device of  claim 23 , wherein the two or more PCM containers are sized and configured to removably fit inside the first and second PCM carrier compartments. 
     
     
         25 . The thermal transfer device of  claim 23 , wherein each of the first PCM carrier compartment and the second PCM carrier compartment is defined by exterior walls and one or more interior walls. 
     
     
         26 . The thermal transfer device of  claim 25 , wherein at least one of the exterior walls include one or more notches or openings extending therethrough. 
     
     
         27 . The thermal transfer device of  claim 25 , wherein the at least one PCM carrier includes a flexible handle attached to at least one of the exterior walls thereof. 
     
     
         28 . The thermal transfer device of  claim 1 , wherein the top plate is positioned substantially in a first plane, the first pillar is positioned substantially in a second plane that is substantially perpendicular to the first plane, and the second pillar is positioned substantially in a third plane that is substantially parallel to the second plane. 
     
     
         29 . A temperature-stabilized container, comprising:
 at least one first wall defining a storage space;   at least one second wall spaced outwardly from the at least one first wall and defining an insulation space therebetween;   a thermal transfer device including a first portion positioned inside the storage space, and a second portion positioned outside the storage space, the thermal transfer device including:
 a housing including,
 a top plate; 
 a first pillar extending from the top plate, the first pillar being positioned inside the storage space; and 
 a second pillar extending from the top plate, the second pillar being positioned inside the storage space; 
 
 at least one phase change material (PCM) carrier containing at least one second PCM and being in thermal communication with one or more of the first pillar or the second pillar, the at least one PCM carrier being positioned inside the storage space; and 
 a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar, or the second pillar. 
   
     
     
         30 . The temperature-stabilized container of  claim 29 , wherein the thermal transfer device includes a base plate spaced from the top plate and from which the first and second pillars extend. 
     
     
         31 . The temperature-stabilized container of  claim 30 , wherein the base plate of the thermal transfer device is attached to the first pillar and second pillar and positioned generally opposite to the top plate. 
     
     
         32 . The temperature-stabilized container of  claim 29 , herein the second pillar of the thermal transfer device includes a first pillar portion and a second pillar portion connected together. 
     
     
         33 . The temperature-stabilized container of  claim 32 , wherein the heat pipe of the thermal transfer device is positioned between and secured in thermal communication to the first and second pillar portions. 
     
     
         34 . The temperature-stabilized container of  claim 29 , wherein the heat pipe includes a second thermal end in thermal communication with one or more of a cooling unit or a heating unit. 
     
     
         35 . The temperature-stabilized container of  claim 34 , wherein the second thermal end of the heat pipe is in thermal communication with a thermoelectric cooler (TEC) configured to cool the second thermal end of the heat pipe. 
     
     
         36 . The temperature-stabilized container of  claim 35 , wherein the TEC includes a cold side in thermal communication with the second end of the heat pipe and a hot side in thermal communication with one or more secondary heat pipes at first thermal ends thereof. 
     
     
         37 . The temperature-stabilized container of  claim 35 , wherein the TEC is positioned outside of the storage chamber. 
     
     
         38 . The temperature-stabilized container of  claim 35 , further including an electronic controller operably coupled to the TEC and configured to control operation of the TEC. 
     
     
         39 . The temperature-stabilized container of  claim 36 , wherein the one or more secondary heat pipes include second ends in thermal communication with one or more heat sinks. 
     
     
         40 . The temperature-stabilized container of  claim 39 , further including one or more fans positioned to produce fluid flow across the one or more heat sinks. 
     
     
         41 . The temperature-stabilized container of  claim 39 , further including a cover at least partially enclosing the one or more heat sinks. 
     
     
         42 . The temperature-stabilized container of  claim 41 , wherein the cover includes one or more vent openings sized and configured to allow air flow to the one or more heat sinks or from the one or more heat sinks. 
     
     
         43 . The temperature-stabilized container of  claim 29 , further including at least one PCM container containing at least one first PCM and being in thermal communication with the first pillar of the housing, the at least one PCM container being positioned inside the storage space. 
     
     
         44 . The temperature-stabilized container of  claim 43 , wherein the at least one first PCM is substantially the same as the at least one second PCM. 
     
     
         45 . The temperature-stabilized container of  claim 43 , wherein the at least one first PCM is different from the at least one second PCM. 
     
     
         46 . The temperature-stabilized container of  claim 43 , wherein the at least one PCM container is fastened to the first pillar. 
     
     
         47 . The temperature-stabilized container of  claim 46 , wherein the at least one PCM container includes one or more pivotable locks, the first pillar includes one or more cutouts sized and positioned to accept corresponding ones of the one or more pivotable locks in a manner that pivoting of the one or more pivotable locks fastens or unfastens the at least one PCM container relative to the first 
     
     
         48 . The temperature-stabilized container of  claim 29 , wherein the housing includes a third pillar extending from the top plate, the second pillar being positioned between the first pillar and the third panel. 
     
     
         49 . The temperature-stabilized container of  claim 43 , wherein the at least one first PCM includes first and second PCM portions, and wherein the at least one PCM container includes a first PCM container containing the first PCM portion in thermal communication with the first pillar and a second PCM container containing the second PCM portion in thermal communication with the third pillar. 
     
     
         50 . The temperature-stabilized container of  claim 49 , wherein the first PCM portion is the same as the second. PCM portion. 
     
     
         51 . The temperature-stabilized container of  claim 49 , wherein the second PCM container is fastened to a third pillar extending from the top plate. 
     
     
         52 . The temperature-stabilized container of  claim 51 ,herein the second PCM container includes one or more pivotable locks, the third pillar includes one or more cutouts sized and positioned to accept the one or more pivotable locks in a manner that pivoting of corresponding ones of the one or more pivotable locks fastens or unfastens the second PCM container relative to the third panel. 
     
     
         53 . The temperature-stabilized container of  claim 29 , wherein the at least one PCM carrier is removably positioned in a space defined by the first and second pillars. 
     
     
         54 . The temperature-stabilized container of claim, wherein the at least one PCM carrier is magnetically secured to the housing. 
     
     
         55 . The temperature-stabilized container of  claim 29 , wherein the at least one PCM carrier includes a first PCM carrier compartment and a second PCM carrier compartment, and wherein the at least one second PCM includes two or more PCM containers positioned inside the first and second PCM carrier compartments, respectively. 
     
     
         56 . The temperature-stabilized container of  claim 55 , wherein the two or more PCM containers are sized and configured to removably fit inside the first and second PCM carrier compartments. 
     
     
         57 . The temperature-stabilized container of  claim 55 , wherein each of the first PCM carrier compartment and the second. PCM carrier compartment is defined by exterior walls and one or more interior walls. 
     
     
         58 . The temperature-stabilized container of  claim 57 , wherein the exterior walls of the at least one PCM carrier include one or more notches or openings extending therethrough. 
     
     
         59 . The temperature-stabilized container of  claim 57 , wherein the at least one PCM carrier includes a flexible handle attached to at least one of the exterior walls thereof. 
     
     
         60 . The temperature-stabilized container of  claim 29 , wherein the top plate is positioned substantially in a first plane, the first pillar is positioned substantially in a second plane that is substantially perpendicular to the first plane, and the second pillar is positioned substantially in a third plane that is substantially parallel to the second plane. 
     
     
         61 . A method of maintaining a temperature in a closed storage space, the method comprising:
 providing a temperature-stabilized container that includes,
 a shell defining a storage space; 
 a thermal transfer device positioned inside the storage space, the thermal transfer device including,
 a top plate; 
 a first pillar extending from the top plate, the first pillar being positioned inside the storage space; and 
 a second pillar extending from the top plate, the second pillar being positioned inside the storage space; 
 at least one phase change material (PCM) container containing at least one first PCM and being in thermal communication with the first pillar of the housing, the at least one PCM container being positioned inside the storage space; 
 at least one PCM carrier containing at least one second PCM and being in thermal communication with one or more of the first pillar or the second pillar, the at least one PCM carrier being positioned inside the storage space; and 
 a heat pipe having a first thermal end thereof in thermal communication with one or more of the top plate, the first pillar or the second pillar; and 
 
   removing heat from the storage space by cooling a second thermal end of the heat pipe to produce heat transfer from the at least one first PCM and the at least one second PCM to the second end of heat pipe.   
     
     
         62 . The method of  claim 61 , further including maintaining a selected temperature or a temperature range inside the storage space by:
 measuring one or more of temperature inside the storage space, temperature of the at least one first or at least one second PCM, amount of the at least one first or at least one second PCM in a solid phase, or amount of the at least one first or at least one second PCM in a liquid phase; and   via a controller, operating a cooling device in thermal communication with the second thermal end of the heat pipe to cool the storage space to a selected temperature at least partially based on one or more of the measured temperature inside the storage space, temperature of the at least one first or at least one second PCM, amount of the at least one first or at least one second PCM in a solid phase, or amount of the first or at least one second PCM in a liquid phase.   
     
     
         63 . The method of  claim 62 , wherein the cooling device includes thermoelectric cooler (TEC). 
     
     
         64 . The method of  claim 63 , further including cooling a hot side of the TEC. 
     
     
         65 . The method of  claim 64 , further including channeling heat from the hot side of the TEC to one or more heat sinks. 
     
     
         66 . The method of  claim 65 , further including flowing air over the one or more heat sinks effective to remove heat therefrom.