Optical module

Abstract

The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.

1 . An optical module, comprising:
 a chip, which comprises at least one wiring side, and is provided with first signal interface pads arranged parallel to the wiring side;   a circuit board which is provided with a plurality of second signal interface pads corresponding to the first signal interface pads, wherein at least two of distances between the respective second signal interface pads and the wiring side are different from each other; and   signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.   
     
     
         2 . The optical module according to  claim 1 , projections of centers of the respective second signal interface pads onto the wiring side do not coincide with each other. 
     
     
         3 . The optical module according to  claim 1 , the respective second signal interface pads are arranged in two rows on the circuit board, and each of the rows is parallel to the wiring side. 
     
     
         4 . The optical module according to  claim 3 , the respective second signal interface pads are grouped into N consecutive groups, wherein N is more than or equal to 3; and the second signal interface pads in odd groups are located in a same row, and the second signal interface pads in even groups are located in the other row. 
     
     
         5 . The optical module according to  claim 1 , the respective second signal interface pads lie within two boundary lines which are extending lines of adjacent sides of the wiring side. 
     
     
         6 . The optical module according to  claim 1 , first ground pads located in the same row as the first signal interface pads are arranged on the chip; and second ground pads corresponding to the first ground pads are arranged on the circuit board; and
 the optical module further comprises ground wires configured to connect the corresponding first ground pads and second ground pads.   
     
     
         7 . The optical module according to  claim 6 , at least two first ground pads are arranged on the chip, and every two adjacent first ground pads are spaced by at least one first signal interface pad. 
     
     
         8 . The optical module according to  claim 6 , at least two first ground pads are arranged on the chip, and every two adjacent first ground pads are spaced by two first signal interface pads. 
     
     
         9 . The optical module according to  claim 6 , distance between the second ground pads and the wiring side is equal to shortest one of distances between the respective second signal interface pads and the wiring side. 
     
     
         10 . The optical module according to  claim 6 , the respective second ground pads lie within two boundary lines which are extending lines of adjacent sides of the first wiring side. 
     
     
         11 . An optical module, comprising a chip, a circuit board, and signal wires:
 the chip is located above the circuit board;   the chip comprises at least one wiring side, and size of the wiring side is no more than size of the circuit board, and a plurality of first signal interface pads which do not coincide with each other are arranged on the chip;   a plurality of second signal interface pads corresponding to the first signal interface pads are arranged on the circuit board, the second signal interface pads do not coincide with each other, and projections of centers of the second signal interface pads onto an extending line of a perpendicular line perpendicular to the wiring side are distributed at N positions, wherein N is a positive integer more than 1; and   the signal wires are configured to connect the corresponding first signal interface pads and second signal interface pads.   
     
     
         12 . The optical module according to  claim 11 :
 the first signal interface pads are arranged in a row parallel to the wiring side.   
     
     
         13 . The optical module according to  claim 12 :
 projections of the signal wires onto the chip are perpendicular to the wiring side.   
     
     
         14 . The optical module according to  claim 12 :
 projections of centers of the second signal interface pads onto the wiring side do not coincide with each other.   
     
     
         15 . The optical module according to  claim 12 :
 the second signal interface pads are arranged on the circuit board in two rows, and each of the rows is parallel to the wiring side.   
     
     
         16 . The optical module according to  claim 12 , the respective second signal interface pads are further grouped into N consecutive groups, wherein N is more than or equal to 3; and the second signal interface pads in odd groups are located in a same row, and the second signal interface pads in even groups are located in the other row. 
     
     
         17 . The optical module according to  claim 12 , the respective second signal interface pads lie within two boundary lines which are extending lines of adjacent sides of the wiring side. 
     
     
         18 . The optical module according to  claim 12 , first ground pads located in the same row as the first signal interface pads are arranged on the chip; and second ground pads corresponding to the first ground pads are arranged on the circuit board; and
 the optical module further comprises ground wires configured to connect the corresponding first ground pads and second ground pads.   
     
     
         19 . The optical module according to  claim 18 , every two adjacent first ground pads are spaced by two first signal interface pads. 
     
     
         20 . The optical module according to  claim 18 , distance between the second ground pads and the wiring side is equal to shortest one of distances between the respective second signal interface pads and the wiring side.