LED Packaging Structure Having Stacked Arrangement Of Protection Element And LED Chip

Abstract

A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.

What is claimed is: 
     
         1 . A light emitting diode (LED) packaging structure, comprising:
 a frame having a first electrode portion and a second electrode portion;   a LED chip located on a top surface of the frame and electrically connected to the first electrode portion and the second electrode portion; and   a concave portion disposed on the top surface of the frame and below a bottom surface of the LED chip.   
     
     
         2 . The LED packaging structure of  claim 1 , wherein the concave portion comprises a first concave portion and a second concave portion. 
     
     
         3 . The LED packaging structure of  claim 2 , wherein the first concave portion and the second concave portion are located in the first electrode portion and second electrode portion respectively. 
     
     
         4 . The LED packaging structure of  claim 2 , further comprising a protection element disposed in both of the first concave portion and the second concave portion. 
     
     
         5 . The LED packaging structure of  claim 4 , further comprising an encapsulant, wherein the encapsulant covers at least a part of the first electrode, at least a part of the second electrode, at least a part of the protection element and at least a part of the LED chip. 
     
     
         6 . The LED packaging structure of  claim 5 , wherein the encapsulant comprises a transparent encapsulant or a fluorescent encapsulant. 
     
     
         7 . The LED packaging structure of  claim 4 , wherein a depth of the concave is deeper than a thickness of the protection element. 
     
     
         8 . The LED packaging structure of  claim 7 , wherein the concave comprises an upper region and a lower region. 
     
     
         9 . The LED packaging structure of  claim 7 , wherein the protective element is located in the upper region, and wherein the lower region is filled with a non-conductive filler. 
     
     
         10 . The LED packaging structure of  claim 3 , wherein the LED chip is connected to the first electrode portion and the second electrode portion directly.